18651718. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18651718 titled 'MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
The manufacturing method for a semiconductor device involves preparing a wafer structure with a main surface electrode, forming a terminal electrode, using a mask member to apply sealant over the terminal electrode, and creating a sealing insulator by thermally curing the sealant.
- Wafer structure preparation with main surface electrode
- Formation of terminal electrode on main surface electrode
- Use of mask member to apply sealant over terminal electrode
- Creation of sealing insulator through thermal curing of sealant
Potential Applications: - Semiconductor manufacturing industry - Electronics and technology sector
Problems Solved: - Ensures proper sealing and insulation of terminal electrodes - Enhances the durability and reliability of semiconductor devices
Benefits: - Improved performance and longevity of semiconductor devices - Enhanced protection against external elements
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Method This technology can be utilized in the production of various semiconductor devices, such as microchips, sensors, and integrated circuits. It can benefit companies in the electronics and technology sectors by improving the quality and reliability of their products.
Questions about Semiconductor Device Manufacturing Method: 1. How does the use of a mask member improve the application of sealant in semiconductor device manufacturing?
The mask member helps to precisely apply the sealant over the terminal electrode, ensuring proper coverage and insulation.
2. What are the key advantages of forming a sealing insulator through thermal curing of the sealant in semiconductor device manufacturing?
Thermal curing of the sealant results in a durable and reliable sealing insulator that enhances the performance and longevity of semiconductor devices.
Original Abstract Submitted
A manufacturing method for a semiconductor device includes a step of preparing a wafer structure that includes a wafer having a main surface, and a main surface electrode arranged on the main surface, a step of forming a terminal electrode on the main surface electrode, a step of preparing a mask member that has a frame portion demarcating an opening portion exposing an inner portion of the main surface and configuring to overlap a peripheral edge portion of the main surface, and arranging the mask member on the main surface such that the frame portion overlaps the peripheral edge portion of the main surface, a step of supplying a sealant including a liquid thermosetting resin into the opening portion such as to cover the terminal electrode and a step of forming a sealing insulator by thermally curing the sealant.
