18651159. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tomohira Kikuchi of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18651159 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a conductive support member, a control element, an insulating element, a driver element, and a sealing resin.
- The conductive support member includes a first lead and a second lead, each with a pad portion.
- The control element is mounted on the first pad portion, while the insulating element is mounted on the first pad portion and connected to the control element.
- The driver element is mounted on the second pad portion and connected to the insulating element.
- The sealing resin covers all the components mentioned above.
- The first pad portion has a first edge adjacent to the second pad portion, while the second pad portion has a second edge adjacent to the first edge.
Potential Applications: - This technology can be used in various semiconductor devices such as integrated circuits, sensors, and power modules.
Problems Solved: - Provides a compact and efficient way to integrate control, driver, and insulating elements in a semiconductor device. - Ensures proper electrical connections and protection of sensitive components.
Benefits: - Improved reliability and performance of semiconductor devices. - Simplified manufacturing process due to the integration of multiple elements in a single package.
Commercial Applications: - This technology can be applied in the electronics industry for the production of advanced semiconductor devices with enhanced functionality and durability.
Questions about the technology: 1. How does the integration of control, driver, and insulating elements benefit the overall performance of the semiconductor device? 2. What are the specific advantages of using a sealing resin to cover the components in the semiconductor device?
Original Abstract Submitted
A semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. The conductive support member includes a first lead and a second lead. The first lead has a first pad portion. The second lead has a second pad portion. The second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. The control element is mounted on the first pad portion. The insulating element is mounted on the first pad portion and electrically connected to the control element. The driver element is mounted on the second pad portion and electrically connected to the insulating element. The sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. As viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. The first edge has a first end and a second end opposite in the second direction. As viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. The second edge has a third end and a fourth end opposite in the second direction. One of the third end and the fourth end is located between the first end and the second end in the second direction.
