18650970. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masaaki Mori of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18650970 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor element, a first lead with a die pad portion and a first terminal portion, and a sealing resin. The first lead has a reverse surface exposed from a resin surface, and the first terminal portion consists of three parts: a first portion extending outward in the x direction, a second portion for mounting on the z direction, and a third portion in between.
- The first lead of the semiconductor device has a unique structure with different portions serving specific functions.
- The second portion of the first terminal overlaps with the sealing resin in the z direction, providing stability and protection.
- The design of the first lead enhances the overall performance and durability of the semiconductor device.
- The integration of the first lead with the sealing resin improves the reliability and efficiency of the device.
- This innovation in semiconductor device design showcases advancements in packaging technology.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, computers, and automotive systems. - It can be used in industrial applications where reliable and high-performance semiconductor devices are required.
Problems Solved: - Enhances the stability and protection of semiconductor devices. - Improves the reliability and efficiency of electronic systems. - Advances packaging technology in the semiconductor industry.
Benefits: - Increased durability and performance of semiconductor devices. - Enhanced reliability and efficiency of electronic systems. - Improved overall quality of electronic products.
Commercial Applications: Title: Advanced Semiconductor Device Packaging Technology This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment, leading to more reliable and efficient electronic systems in the market.
Questions about Semiconductor Device Packaging Technology: 1. How does the unique structure of the first lead improve the performance of the semiconductor device? - The different portions of the first lead serve specific functions, enhancing stability and protection. 2. What are the potential applications of this semiconductor device packaging technology? - This technology can be applied in various electronic devices and industrial applications, improving reliability and efficiency.
Original Abstract Submitted
A semiconductor device includes a semiconductor element; a first lead including a die pad portion and a first terminal portion, and a sealing resin. A first lead reverse surface is exposed from a second resin surface. The first terminal portion includes a first portion extending outward from a third resin surface to a first side in an x direction, a second portion located on a first side in a z direction relative to the first portion and used for mounting, and a third portion interposed between the first portion and the second portion. The second portion overlaps with the sealing resin as viewed in the z direction.
