18650225. SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Ming-Fa Chen of Taichung City (TW)

Hsien-Wei Chen of Hsinchu (TW)

Sung-Feng Yeh of Taipei City (TW)

Jie Chen of New Taipei City (TW)

SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18650225 titled 'SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME

The semiconductor package described in the patent application consists of a first semiconductor die, a second semiconductor die, and multiple bumps. The first semiconductor die has a front side and a backside, with the second semiconductor die positioned at the backside and electrically connected to the first die. The bumps are located on the front side of the first semiconductor die, physically connecting the die pads.

  • The first semiconductor die is smaller in width compared to the second semiconductor die.
  • The second semiconductor die is electrically connected to the first semiconductor die.
  • Bumps physically connect the die pads of the first semiconductor die.
  • The package design allows for efficient electrical connections between the two dies.
  • The smaller width of the first semiconductor die may lead to space-saving benefits in certain applications.

Potential Applications: - This technology could be used in various electronic devices requiring compact semiconductor packaging. - It may find applications in mobile devices, IoT devices, and other compact electronic systems.

Problems Solved: - Efficient electrical connections between multiple semiconductor dies. - Space-saving design for semiconductor packaging.

Benefits: - Space-saving design for compact electronic devices. - Improved electrical connections between semiconductor dies.

Commercial Applications: Title: Compact Semiconductor Packaging for Electronic Devices This technology could be utilized in the production of mobile phones, IoT devices, and other compact electronic systems, enhancing their performance and compactness in design.

Questions about Semiconductor Packaging: 1. How does the size difference between the first and second semiconductor dies impact the overall efficiency of the package? 2. What are the potential challenges in manufacturing semiconductor packages with multiple dies?


Original Abstract Submitted

A semiconductor package includes a first semiconductor die, a second semiconductor die and a plurality of bumps. The first semiconductor die has a front side and a backside opposite to each other. The second semiconductor die is disposed at the backside of the first semiconductor die and electrically connected to first semiconductor die. The plurality of bumps is disposed at the front side of the first semiconductor die and physically connects first die pads of the first semiconductor die. A total width of the first semiconductor die may be less than a total width of the second semiconductor die.

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