18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Szu-Ying Chen of Toufen Township (TW)
Dun-Nian Yaung of Taipei City (TW)
HYBRID BONDING WITH UNIFORM PATTERN DENSITY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18640167 titled 'HYBRID BONDING WITH UNIFORM PATTERN DENSITY
The abstract of the patent application describes a chip with a semiconductor substrate, integrated circuits, and a surface dielectric layer. The chip also includes a plurality of metal pads distributed uniformly throughout the surface, with active metal pads connected to the integrated circuits and dummy metal pads that are not connected.
- The chip contains a semiconductor substrate and integrated circuits within it.
- A surface dielectric layer covers the integrated circuits.
- Metal pads are spread evenly across the surface of the chip.
- The metal pads include active pads connected to the integrated circuits and dummy pads that are not connected.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design
Problems Solved: - Efficient distribution of metal pads on a chip - Improved connectivity within integrated circuits
Benefits: - Enhanced performance of integrated circuits - Simplified chip design process
Commercial Applications: Title: "Advanced Chip Design for Enhanced Connectivity in Integrated Circuits" This technology can be applied in various industries such as semiconductor manufacturing, electronics, and telecommunications. It can lead to more efficient and reliable integrated circuits, improving overall device performance.
Prior Art: Researchers can explore prior patents related to semiconductor chip design, integrated circuits, and metal pad distribution to understand the existing technology landscape.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing and integrated circuit design may be conducting studies on optimizing metal pad distribution for improved connectivity and performance.
Questions about Metal Pad Distribution: 1. How does the distribution of metal pads impact the overall performance of integrated circuits? - The distribution of metal pads plays a crucial role in ensuring proper connectivity and signal transmission within integrated circuits.
2. What are the key differences between active metal pads and dummy metal pads in chip design? - Active metal pads are connected to the integrated circuits and play a functional role, while dummy metal pads are not connected and serve as placeholders for future expansion or testing purposes.
Original Abstract Submitted
A chip includes a semiconductor substrate, integrated circuits with at least portions in the semiconductor substrate, and a surface dielectric layer over the integrated circuits. A plurality of metal pads is distributed substantially uniformly throughout substantially an entirety of a surface of the chip. The plurality of metal pads has top surfaces level with a top surface of the surface dielectric layer. The plurality of metal pads includes active metal pads and dummy metal pads. The active metal pads are electrically coupled to the integrated circuits. The dummy metal pads are electrically decoupled from the integrated circuits.
