18638947. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
Organization Name
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SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18638947 titled 'SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
Simplified Explanation: The patent application describes a method and apparatus for bonding substrates together using a seal and process gas supply.
- The bonding apparatus includes two chucks to hold the substrates, a seal between them, and a process gas supply device.
- The first chuck holds the first substrate, while the second chuck holds the second substrate.
- The seal is placed between the chucks and the substrates to create a bonding space.
- The process gas supply device supplies gas to the bonding space for the bonding process.
Key Features and Innovation:
- Use of two chucks to hold substrates for bonding.
- Seal arrangement between the chucks and substrates.
- Process gas supply for the bonding process.
Potential Applications: The technology can be used in semiconductor manufacturing, microelectronics, and other industries requiring precise substrate bonding.
Problems Solved: This technology addresses the challenge of bonding substrates accurately and securely.
Benefits:
- Improved bonding accuracy.
- Enhanced bonding strength.
- Increased efficiency in substrate bonding processes.
Commercial Applications: The technology can be applied in the production of electronic devices, sensors, and optical components.
Prior Art: Researchers can explore prior art related to substrate bonding methods and apparatus in the semiconductor and microelectronics industries.
Frequently Updated Research: Stay updated on advancements in substrate bonding techniques and equipment for potential improvements in the technology.
Questions about Substrate Bonding: 1. How does the seal between the chucks and substrates contribute to the bonding process? 2. What are the advantages of using a process gas supply device in substrate bonding?
Original Abstract Submitted
A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.
