18633312. PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD
Organization Name
Inventor(s)
SHINICHIRO Koga of Tochigi (JP)
PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18633312 titled 'PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD
Simplified Explanation: The patent application discusses a method of determining whether to perform planarization processing by projecting a pressing member to separate a planarization member from a composition on a substrate.
- Key Features and Innovation:
- Determining planarization processing based on the separation of the planarization member from the substrate.
- Ensures stable separation of the planarization member for efficient processing.
Potential Applications: This technology can be applied in semiconductor manufacturing, microelectronics, and other industries requiring precise planarization processes.
Problems Solved: This technology addresses the challenge of ensuring stable separation of the planarization member during processing, leading to improved efficiency and quality.
Benefits:
- Enhanced efficiency in planarization processing.
- Improved quality of planarized compositions on substrates.
- Reduced risk of damage to substrates during planarization.
Commercial Applications: The technology can be utilized in semiconductor fabrication facilities, electronic device manufacturing plants, and research institutions focusing on microfabrication processes.
Prior Art: Readers can explore prior patents related to planarization methods, substrate processing, and semiconductor manufacturing to understand the background of this technology.
Frequently Updated Research: Stay informed about the latest advancements in planarization techniques, substrate processing innovations, and semiconductor manufacturing developments to enhance your knowledge in this field.
Questions about Planarization Processing: 1. How does this technology improve the efficiency of planarization processes? 2. What are the potential applications of this innovation in the semiconductor industry?
Original Abstract Submitted
Whether to perform planarization processing is determined by projecting a pressing member in a state where a planarization member held by a member holding unit is not in contact with a composition on a substrate held by a substrate holding unit. Determining whether to perform the planarization processing in such a manner enables the planarization member used to planarize the composition on the substrate to be stably separated.
