18632924. LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD
Organization Name
Inventor(s)
HIROKI Kihara of Kanagawa (JP)
SATOSHI Tsutsui of Kanagawa (JP)
LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18632924 titled 'LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD
The liquid ejection head described in the patent application is designed to eject liquid efficiently and reliably. The key innovation lies in the use of an epoxy resin composition containing specific ingredients to create strong bonds between the various components of the head.
- The recording element substrate ejects liquid, supported by a supporting member with a supply channel.
- A channel member supplies liquid to the support channel.
- Bonds between components are made of an epoxy resin composition with specific properties.
- The epoxy resin mixture includes a liquid epoxy resin and a coumarone resin.
- The weight average molecular weight of the epoxy resin mixture is between 300 and 600.
- The liquid ejection head contains a cured substance of an adhesive agent with the epoxy resin composition.
Potential Applications: - Printing technology - Industrial manufacturing processes - Biomedical applications
Problems Solved: - Ensuring reliable liquid ejection - Creating strong bonds between components - Improving overall performance and durability
Benefits: - Enhanced liquid ejection efficiency - Increased reliability and longevity - Improved overall functionality
Commercial Applications: Title: Advanced Liquid Ejection Technology for Industrial Printing This technology can be used in industrial inkjet printers, 3D printing systems, and other liquid ejection devices. It can revolutionize the printing industry by improving speed, accuracy, and reliability.
Questions about Liquid Ejection Technology: 1. How does the epoxy resin composition improve the bonding between components in the liquid ejection head? - The epoxy resin composition contains specific ingredients that create strong and durable bonds between the components, ensuring reliable performance.
2. What are the potential industrial applications of this liquid ejection technology? - This technology can be applied in various industries such as printing, manufacturing, and biomedical fields for efficient liquid ejection processes.
Original Abstract Submitted
A liquid ejection head includes a recording element substrate configured to eject a liquid, a supporting member configured to support the recording element substrate and including a supply channel configured to supply a liquid to the recording element substrate, and a channel member configured to supply a liquid to the supply channel, wherein at least one bonding surface between two of the recording element substrate, the supporting member, and the channel member is made of an epoxy resin composition containing an epoxy resin mixture and a powder curing agent, the epoxy resin mixture contains an epoxy resin that is liquid at normal temperature and a coumarone resin that is dissolvable in the epoxy resin, a weight average molecular weight of the epoxy resin mixture is 300 or more and 600 or less, and the liquid ejection head contains a cured substance of an adhesive agent containing the epoxy resin composition.
