18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Dahee Park of Seongnam-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18626579 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate, an interposer, multiple semiconductor devices, a dam structure, and a stress relief component.
- The package substrate serves as the foundation for the semiconductor package.
- The interposer is positioned on the package substrate and acts as a connection platform for the semiconductor devices.
- The semiconductor devices are placed on the interposer, spaced apart from each other, and electrically connected to it.
- A dam structure is located on the interposer, running along its perimeter and separated from the semiconductor devices.
- The stress relief component includes an elastic member that fills the gaps between the semiconductor devices and the dam structure, providing mechanical support and reducing stress on the components.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Reduces mechanical stress on semiconductor devices. - Enhances the reliability and longevity of electronic components. - Improves the overall performance of electronic devices.
Benefits: - Increased durability and reliability of semiconductor packages. - Enhanced mechanical support for delicate components. - Improved performance and longevity of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be utilized in the consumer electronics industry to improve the quality and durability of electronic devices, leading to higher customer satisfaction and brand loyalty. It can also benefit manufacturers of automotive electronics, medical devices, and industrial equipment by providing more robust and reliable semiconductor packaging solutions.
Questions about Semiconductor Packaging Technology: 1. How does the stress relief component improve the reliability of semiconductor devices in the package? The stress relief component, with its elastic member, helps to reduce mechanical stress on the semiconductor devices by filling the gaps between the devices and the dam structure, thereby enhancing their overall reliability and longevity.
2. What are the potential cost implications of implementing this advanced semiconductor packaging technology? The initial implementation cost of this technology may be higher due to the additional components involved, but the long-term benefits of improved reliability and performance can outweigh the initial investment.
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer on the package substrate, a plurality of semiconductor devices on the interposer and spaced apart from each other, the semiconductor devices being electrically connected to the interposer, a dam structure on the interposer extending along a peripheral region of the interposer, the dam structure being spaced apart from the semiconductor devices, and a stress relief on the interposer, the stress relief including an elastic member that fills gaps between the semiconductor devices and the dam structure.
