18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
PACKAGE STRUCTURE WITH PROTECTIVE LID
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Meng-Tsung Kuo of Tainan City (TW)
Hui-Chang Yu of Hsinchu County (TW)
Chih-Kung Huang of Hsinchu (TW)
Wei-Teng Chang of Hsinchu City (TW)
PACKAGE STRUCTURE WITH PROTECTIVE LID - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624727 titled 'PACKAGE STRUCTURE WITH PROTECTIVE LID
The abstract of the patent application describes a package structure that includes a chip-containing structure, adhesive elements with different thermal conductivities, and a protective lid attached to the chip-containing structure.
- The package structure consists of a chip-containing structure on a substrate.
- A first adhesive element with a certain thermal conductivity is directly above the chip-containing structure.
- Multiple second adhesive elements with higher thermal conductivities are spaced apart above the chip-containing structure.
- A protective lid is attached to the chip-containing structure through the adhesive elements, extending across the opposite sidewalls of the chip-containing structure.
Potential Applications: - This package structure could be used in electronic devices to enhance thermal management and protect sensitive components. - It may find applications in the semiconductor industry for improved packaging solutions.
Problems Solved: - Provides better thermal conductivity for heat dissipation in electronic devices. - Offers protection to the chip-containing structure from external elements.
Benefits: - Improved thermal management for electronic devices. - Enhanced protection for sensitive components. - Potential for increased performance and longevity of electronic devices.
Commercial Applications: Title: Enhanced Thermal Management Package Structure for Electronic Devices This technology could be utilized in smartphones, laptops, tablets, and other electronic devices to improve thermal performance and reliability. It may have significant implications for the semiconductor packaging industry.
Questions about the technology: 1. How does the package structure improve thermal management in electronic devices? 2. What are the key advantages of using adhesive elements with different thermal conductivities in the package structure?
Original Abstract Submitted
A package structure is provided. The package structure includes a chip-containing structure over a substrate and a first adhesive element directly above the chip-containing structure. The first adhesive element has a first thermal conductivity. The package structure also includes multiple second adhesive elements directly above the chip-containing structure. The second adhesive elements are spaced apart from each other, each of the second adhesive elements has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The package structure further includes a protective lid attached to the chip-containing structure through the first adhesive element and the second adhesive elements. The protective lid extends across opposite sidewalls of the chip-containing structure.
