18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation)

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW

Organization Name

Intel Corporation

Inventor(s)

Ryan Joseph Carrazzone of Chandler AZ (US)

Anastasia Arrington of Queen Creek AZ (US)

Haobo Chen of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Catherine Ka-Yan Mau of Phoenix AZ (US)

Kyle Matthew Mcelhinny of Tempe AZ (US)

Dingying Xu of Chandler AZ (US)

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW - A simplified explanation of the abstract

This abstract first appeared for US patent application 18620569 titled 'METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW

The patent application discloses systems, apparatus, articles of manufacture, and methods to reduce variation in height of bumps after flow in an integrated circuit package.

• The apparatus includes a substrate with multiple bumps, each consisting of solder on metal pads of varying widths and thicknesses.
• The second bump has a narrower width compared to the first bump, but matches its thickness.
• The third bump has an even narrower width than the second bump.

Potential Applications:

• This technology can be applied in the manufacturing of integrated circuit packages to ensure uniform bump heights.
• It can improve the reliability and performance of electronic devices by reducing variations in bump heights.

Problems Solved:

• Addresses the issue of inconsistent bump heights in integrated circuit packages.
• Ensures better connectivity and reliability of electronic components.

Benefits:

• Enhanced performance and reliability of electronic devices.
• Improved manufacturing efficiency and quality control.

Commercial Applications:

• This technology can be utilized in the production of various electronic devices such as smartphones, laptops, and IoT devices.
• It can benefit semiconductor manufacturers and electronics companies looking to enhance the quality of their products.

Prior Art:

• Researchers and engineers in the field of semiconductor packaging and microelectronics may find relevant prior art related to bump height control and soldering techniques.

Frequently Updated Research:

• Stay updated on advancements in semiconductor packaging technology, soldering methods, and quality control measures in the electronics industry.

Questions about bump height control: 1. How does controlling bump height impact the overall performance of electronic devices?

  - Controlling bump height ensures proper connectivity and reliability of electronic components, leading to improved device performance.

2. What are the key factors influencing bump height variations in integrated circuit packages?

  - Factors such as solder composition, pad dimensions, and manufacturing processes can influence bump height variations.

Original Abstract Submitted

Systems, apparatus, articles of manufacture, and methods to reduce variation in height of bumps after flow are disclosed. An example apparatus includes a substrate of an integrated circuit package, a first bump on the substrate, a second bump on the substrate, and a third bump on the substrate. The first bump includes first solder on a first metal pad. The first metal pad has a first width and a first thickness. The second bump includes second solder on a second metal pad. The second metal pad has a second width and a second thickness. The second width is less than the first width. The second thickness matches the first thickness. The third bump includes third solder on a third metal pad. The third metal pad has a third width. The third width less than the second width.