18618029. STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
Contents
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Ki Jun Sung of Icheon-si Gyeonggi-do (KR)
Kyoung Tae Eun of Icheon-si Gyeonggi-do (KR)
Chae Sung Lee of Icheon-si Gyeonggi-do (KR)
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18618029 titled 'STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
Simplified Explanation:
The patent application describes a stack package with a heat dissipation layer, semiconductor dies stacked on the layer, vertical connectors, an encapsulant layer, and redistribution layers.
- Heat dissipation layer formed on a carrier
- Semiconductor dies stacked on the heat dissipation layer
- Vertical connectors connected to the semiconductor dies
- Encapsulant layer to encapsulate the vertical connectors and semiconductor dies
- Redistribution layers connected to the vertical connectors
Key Features and Innovation:
- Efficient heat dissipation with the heat dissipation layer
- Sequential stacking of semiconductor dies for compact design
- Vertical connectors for electrical connections
- Encapsulant layer for protection and insulation
- Redistribution layers for enhanced connectivity
Potential Applications:
This technology could be used in:
- High-performance computing systems
- Data centers
- Automotive electronics
- Aerospace applications
Problems Solved:
- Heat dissipation in stacked semiconductor devices
- Efficient electrical connections in a compact design
- Protection and insulation of semiconductor dies
Benefits:
- Improved performance and reliability
- Space-saving design
- Enhanced thermal management
Commercial Applications:
Potential commercial applications include:
- Advanced computing systems
- Telecommunications equipment
- Industrial automation devices
Questions about Stack Package Technology:
1. How does the heat dissipation layer improve the performance of the stack package? 2. What are the advantages of using vertical connectors in this technology?
Frequently Updated Research:
Ongoing research in this field focuses on:
- Enhancing thermal conductivity of the heat dissipation layer
- Improving the efficiency of vertical connectors in high-speed data transmission.
Original Abstract Submitted
A stack package, and a method of manufacturing the same, includes a heat dissipation layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the heat dissipation layer. Vertical connectors connected to the semiconductor dies are formed. An encapsulant layer coupled to the heat dissipation layer is formed to encapsulate the vertical connectors and the semiconductor dies. Redistribution layers connected to the vertical connectors are formed on the encapsulant layer.
