18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
Contents
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
Organization Name
Texas Instruments Incorporated
Inventor(s)
Christopher Daniel Manack of Flower Mound TX (US)
Patrick Francis Thompson of Allen TX (US)
Qiao Chen of Flower Mound TX (US)
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18617517 titled 'ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
The abstract of the patent application describes a semiconductor device that includes a semiconductor package with a mold compound covering a semiconductor die. The package has a cavity in its surface, within which an electronic device is positioned and coupled to the semiconductor die through a conductive terminal that extends through the mold compound.
- The semiconductor device comprises a semiconductor package with a mold compound covering a semiconductor die.
- The package has a cavity formed in its surface.
- An electronic device is positioned within the cavity.
- The electronic device is coupled to the semiconductor die via a conductive terminal that extends through the mold compound.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a secure and efficient way to connect electronic devices within a semiconductor package. - Ensures proper functionality and connectivity between components.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced durability and longevity of semiconductor packages. - Streamlined manufacturing processes for electronic components.
Commercial Applications: Title: Semiconductor Device Technology for Enhanced Connectivity This technology can be utilized in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial automation.
Questions about Semiconductor Device Technology: 1. How does this technology improve the connectivity and functionality of electronic devices? 2. What are the potential challenges in implementing this semiconductor device technology in various industries?
Original Abstract Submitted
In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.
