18617226. PHOTOSENSITIVE COMPOSITION simplified abstract (FUJIFILM Corporation)
Contents
PHOTOSENSITIVE COMPOSITION
Organization Name
Inventor(s)
Takahiro Okawara of Haibara-gun (JP)
Shoichi Nakamura of Haibara-gun (JP)
Mitsuji Yoshibayashi of Haibara-gun (JP)
PHOTOSENSITIVE COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18617226 titled 'PHOTOSENSITIVE COMPOSITION
The abstract describes a photosensitive composition for exposure to light with a wavelength of 300 nm or shorter, containing a coloring material and a polymerizable monomer, with the total content of the monomer and a photopolymerization initiator being 15% or lower with respect to the total solids content of the composition.
- The photosensitive composition is designed for exposure to light with a wavelength of 300 nm or shorter.
- It includes a coloring material and a polymerizable monomer.
- The total content of the monomer and a photopolymerization initiator is limited to 15% or lower with respect to the total solids content.
- This composition is suitable for applications requiring exposure to short-wavelength light.
Potential Applications: - Microfabrication processes - Photolithography in semiconductor manufacturing - High-resolution printing technologies
Problems Solved: - Limited options for photosensitive compositions for short-wavelength light exposure - Lack of compositions with controlled monomer content - Challenges in achieving precise patterning in microfabrication processes
Benefits: - Enhanced control over polymerization process - Improved resolution in photolithography - Increased efficiency in high-resolution printing
Commercial Applications: Title: Advanced Photosensitive Composition for High-Resolution Applications This technology can be utilized in industries such as semiconductor manufacturing, microelectronics, and high-resolution printing for improved precision and efficiency.
Questions about the technology: 1. How does the limitation on the total content of the monomer and initiator benefit the photosensitive composition? 2. What are the specific advantages of using this composition in microfabrication processes?
Original Abstract Submitted
A photosensitive composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive composition including: a coloring material; and a polymerizable monomer, in which the total content of the polymerizable monomer and a photopolymerization initiator is 15 mass % or lower with respect to the total solids content of the photosensitive composition.
