18616773. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Naoyuki Sano of Kyoto-shi (JP)
Hiroyuki Shinkai of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18616773 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor element, a conductive part, and a sealing resin.
- The semiconductor element has front, back, and lateral surfaces.
- The conductive part is positioned facing the element back surface and has a wiring part for mounting the semiconductor element.
- The sealing resin covers the semiconductor element and the conductive part, while leaving the element front surface exposed.
- The wiring part has a front surface facing the element back surface and a back surface.
- The conductive part includes a terminal part extending from the wiring back surface away from the semiconductor element.
Potential Applications: - This semiconductor device can be used in various electronic applications where reliable and efficient sealing of semiconductor elements is required. - It can be utilized in the manufacturing of integrated circuits, sensors, and other electronic devices.
Problems Solved: - Provides effective sealing and protection for semiconductor elements and conductive parts. - Ensures proper mounting and connection of semiconductor elements in electronic devices.
Benefits: - Enhanced reliability and durability of electronic devices. - Improved performance and longevity of semiconductor components. - Simplified manufacturing processes for electronic devices.
Commercial Applications: - This technology can be applied in the production of consumer electronics, automotive electronics, and industrial equipment. - It has the potential to streamline manufacturing processes and improve the quality of electronic products in various industries.
Questions about Semiconductor Device: 1. How does the sealing resin contribute to the protection of the semiconductor element and conductive part? 2. What are the key advantages of having the element front surface exposed in this semiconductor device design?
Original Abstract Submitted
A semiconductor device according to the present invention is provided with: a semiconductor element which has an element front surface, an element back surface, and an element lateral surface; a conductive part that is arranged in a position where the conductive part faces the element back surface, and has a wiring part on which the semiconductor element is mounted; and a sealing resin which seals the semiconductor element and the conductive part. The wiring part has a wiring front surface that faces the element back surface, and a wiring back surface. The conductive part has a terminal part which extends from the wiring back surface in a direction that is opposite to the semiconductor element. The sealing resin covers the element back surface, the element lateral surface and the wiring front surface. The element front surface is exposed without being covered by the sealing resin.
