18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
METHOD OF FORMING PACKAGE STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Fang-Yu Liang of Taipei City (TW)
Kai-Chiang Wu of Hsinchu City (TW)
METHOD OF FORMING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18616212 titled 'METHOD OF FORMING PACKAGE STRUCTURE
The patent application describes a package structure that includes a semiconductor die, a redistribution layer, multiple antenna patterns, a die attach film, and an insulating encapsulant.
- The semiconductor die has an active surface and a backside surface, with the redistribution layer located on the active surface and electrically connected to the die.
- Antenna patterns are positioned over the backside surface of the semiconductor die.
- The die attach film, containing fillers, is placed between the semiconductor die and the antenna patterns, with an average height equal to the average diameter of the fillers.
- An insulating encapsulant is situated between the redistribution layer and the antenna patterns, encapsulating the semiconductor die and the die attach film.
Potential Applications: - This technology could be used in wireless communication devices. - It may find applications in RFID systems. - It could be utilized in IoT devices for connectivity.
Problems Solved: - Provides a compact and efficient package structure for semiconductor devices. - Enables improved wireless communication capabilities. - Enhances the performance of antenna systems in electronic devices.
Benefits: - Enhanced signal transmission and reception. - Improved reliability and durability of semiconductor devices. - Cost-effective packaging solution for electronic components.
Commercial Applications: Title: Innovative Package Structure for Enhanced Wireless Communication Devices This technology could be applied in the development of advanced smartphones, IoT devices, and RFID systems, enhancing their wireless communication capabilities and overall performance in various commercial applications.
Questions about the technology: 1. How does the die attach film contribute to the overall performance of the package structure? The die attach film, with its fillers, helps in maintaining a uniform height and provides mechanical support to the semiconductor die and antenna patterns.
2. What are the advantages of using an insulating encapsulant in this package structure? The insulating encapsulant not only protects the semiconductor die and die attach film but also ensures electrical insulation between the redistribution layer and the antenna patterns, enhancing the reliability of the device.
Original Abstract Submitted
A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.
