18616019. INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES simplified abstract (Micron Technology, Inc.)
Contents
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
Organization Name
Inventor(s)
Kyle K. Kirby of Eagle ID (US)
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18616019 titled 'INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
The semiconductor device described in the patent application includes a substrate, a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor wrapped around the TSV. The helical conductor is designed to create a magnetic field within the TSV when a current flows through it. Multiple TSVs and helical conductors can be incorporated into the device.
- The semiconductor device features a substrate, a TSV, and a helical conductor.
- The helical conductor generates a magnetic field in the TSV in response to current.
- The device can include multiple TSVs and helical conductors for enhanced functionality.
Potential Applications: This technology could be utilized in various electronic devices requiring efficient magnetic field generation within the substrate.
Problems Solved: The device addresses the need for compact and effective magnetic field generation in semiconductor devices.
Benefits: The technology offers a compact solution for generating magnetic fields within semiconductor substrates, enhancing device performance.
Commercial Applications: Title: Innovative Magnetic Field Generation Technology for Semiconductor Devices This technology could be applied in the development of advanced electronic devices, improving their functionality and performance in various industries.
Prior Art: Researchers can explore prior patents related to magnetic field generation in semiconductor devices to understand the evolution of this technology.
Frequently Updated Research: Researchers are continually exploring new methods to enhance magnetic field generation in semiconductor devices, leading to potential advancements in this field.
Questions about Semiconductor Devices with Helical Conductors: 1. How does the helical conductor contribute to magnetic field generation in the TSV? The helical conductor wrapped around the TSV generates a magnetic field when a current passes through it, enhancing the device's functionality.
2. What are the potential applications of semiconductor devices with helical conductors? Semiconductor devices with helical conductors can be used in various electronic applications requiring efficient magnetic field generation within the substrate.
Original Abstract Submitted
A semiconductor device comprising a substrate is provided. The device further comprises a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.
