18615528. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
Contents
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Ho Young Son of Icheon-si Gyeonggi-do (KR)
Sung Kyu Kim of Icheon-si Gyeonggi-do (KR)
Mi Seon Lee of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18615528 titled 'SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor chip described in the patent application has a body portion with a front surface and a rear surface, a pair of through electrodes penetrating the body portion, an insulating layer over the rear surface and the pair of through electrodes, and a rear connection electrode over the insulating layer connected simultaneously with the pair of through electrodes. The distance between the pair of through electrodes is greater than twice the thickness of the insulating layer.
- The semiconductor chip includes a unique design with through electrodes and a rear connection electrode.
- The insulating layer provides insulation between the rear surface of the body portion and the electrodes.
- The rear connection electrode allows for simultaneous connection with the pair of through electrodes.
- The distance between the through electrodes is carefully controlled to ensure proper functioning of the chip.
- This innovation aims to improve the performance and reliability of semiconductor chips.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, computers, and IoT devices. - It can be applied in the automotive industry for advanced driver assistance systems and infotainment systems.
Problems Solved: - Ensures proper electrical connections within the semiconductor chip. - Prevents short circuits and electrical interference.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced safety and functionality in automotive applications.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Electronic Devices This technology can be commercialized by semiconductor manufacturers to produce high-performance chips for consumer electronics and automotive applications. The market implications include increased demand for reliable and efficient semiconductor chips in various industries.
Prior Art: Readers can explore prior patents related to semiconductor chip design, through electrodes, and insulating layers to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further improve the performance of semiconductor chips. Stay updated on the latest advancements in the field to leverage cutting-edge technology for future applications.
Questions about Semiconductor Chip Technology: 1. How does the distance between the through electrodes impact the performance of the semiconductor chip?
- The distance between the through electrodes affects the electrical conductivity and insulation properties of the chip, influencing its overall performance.
2. What are the key considerations in designing the insulating layer for semiconductor chips?
- Designing the insulating layer involves selecting materials with specific dielectric properties and ensuring uniform thickness to prevent electrical issues.
Original Abstract Submitted
A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.
