18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Yoshihito Otsubo of Nagaokakyo-shi (JP)
Morio Takeuchi of Nagaokakyo-shi (JP)
MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18614965 titled 'MODULE
The abstract of the patent application describes a module with a die pad, signal terminal, electronic component, and sealing resin. The electronic component is connected to the signal terminal via a wire, and the die pad surrounds the signal terminal to protect it.
- Die pad located on a reference plane
- Signal terminal also located on the reference plane
- Electronic component fixed above the die pad
- Sealing resin to seal the components
- Electronic component has two surfaces, one facing the die pad and one facing away
- Die pad includes main body and surrounding portion to protect signal terminal
Potential Applications: - Semiconductor packaging - Electronics manufacturing - Integrated circuit assembly
Problems Solved: - Protecting electronic components and signal terminals - Ensuring proper electrical connections - Sealing components from external elements
Benefits: - Enhanced durability of electronic components - Improved reliability of signal connections - Increased lifespan of modules
Commercial Applications: Title: Advanced Semiconductor Packaging Module for Electronics Manufacturing This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics. It can improve the performance and longevity of these devices, leading to higher customer satisfaction and potentially lower maintenance costs for manufacturers.
Prior Art: Researchers can explore prior patents related to semiconductor packaging, electronic component assembly, and signal terminal protection to understand the evolution of this technology.
Frequently Updated Research: Researchers in the field of semiconductor packaging and electronics manufacturing may be conducting studies on new materials for die pads, innovative sealing techniques, and enhanced wire bonding methods.
Questions about Semiconductor Packaging Module: 1. How does the positioning of the die pad and signal terminal impact the overall performance of the module? 2. What are the potential challenges in scaling up the production of modules using this technology?
1. What are the key components of the module described in the patent application? - The key components of the module include a die pad, signal terminal, electronic component, and sealing resin.
2. How does the die pad protect the signal terminal in the module? - The die pad surrounds the signal terminal to shield it from external elements and ensure its integrity.
Original Abstract Submitted
A module includes a die pad arranged to locate a lower end thereof on a reference plane, a signal terminal arranged to locate a lower end thereof on the reference plane, an electronic component fixed as being superimposed above the die pad, and a sealing resin arranged to seal the die pad, the signal terminal, and the electronic component from above. The electronic component is provided with a component first surface facing a side of the die pad and a component second surface facing a side opposite to the die pad. The component second surface and the signal terminal are electrically connected to each other through a first wire. The die pad includes a die pad main body on which the electronic component is carried and a surrounding portion extending from the die pad main body along the reference plane to surround the signal terminal apart from the signal terminal.
