18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

From WikiPatents
Jump to navigation Jump to search

STACKED VIA STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Po-Han Wang of Hsinchu City (TW)

Hung-Jui Kuo of Hsinchu City (TW)

Yu-Hsiang Hu of Hsinchu City (TW)

STACKED VIA STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18614755 titled 'STACKED VIA STRUCTURE

The abstract describes a stacked via structure in a semiconductor device, involving multiple dielectric layers, conductive vias, and redistribution wiring.

  • The structure includes a first dielectric layer with a via opening, a first conductive via within the opening, and a first redistribution wiring covering them.
  • A second dielectric layer is placed on top, with a second via opening and a second conductive via connected to the first redistribution wiring.
  • The design allows for efficient electrical connections between different layers of the semiconductor device.

Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices such as integrated circuits and microprocessors. - It can improve the performance and reliability of electronic devices by enhancing signal transmission and reducing signal interference.

Problems Solved: - Enables the creation of complex and compact semiconductor devices with multiple layers of wiring and vias. - Enhances the overall functionality and efficiency of electronic systems by optimizing signal routing.

Benefits: - Increased integration density in semiconductor devices. - Improved signal transmission and reduced signal delay. - Enhanced reliability and performance of electronic systems.

Commercial Applications: - This technology can be utilized in the production of high-performance electronic devices for various industries, including telecommunications, computing, and consumer electronics.

Questions about Stacked Via Structure: 1. How does the stacked via structure improve the performance of semiconductor devices? 

  - The stacked via structure allows for efficient electrical connections between different layers, enhancing signal transmission and reducing signal interference.

2. What are the potential applications of this technology in the semiconductor industry? 

  - This technology can be applied in the manufacturing of advanced semiconductor devices such as integrated circuits and microprocessors, improving their performance and reliability.


Original Abstract Submitted

A stacked via structure including a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer and a second conductive via is provided. The first dielectric layer includes a first via opening. The first conductive via is in the first via opening. A first level height offset is between a top surface of the first conductive via and a top surface of the first dielectric layer. The first redistribution wiring covers the top surface of the first conductive via and the top surface of the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer and the first redistribution wiring. The second dielectric layer includes a second via opening. The second conductive via is in the second via opening. The second conductive via is electrically connected to the first redistribution wiring through the second via opening of the second dielectric layer.

Retrieved from "http://wikipatents.org/index.php?title=18614755._STACKED_VIA_STRUCTURE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93924"