18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

BONDING THROUGH MULTI-SHOT LASER REFLOW

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Wei-Yu Chen of Taipei City (TW)

Chia-Shen Cheng of Zhubei City (TW)

Hao-Jan Pei of Hsinchu (TW)

Philip Yu-Shuan Chung of Taipei (TW)

Kuei-Wei Huang of Hsinchu (TW)

Yu-Peng Tsai of Hsinchu (TW)

Hsiu-Jen Lin of Zhubei City (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Chen-Hua Yu of Hsinchu (TW)

Chung-Shi Liu of Hsinchu (TW)

BONDING THROUGH MULTI-SHOT LASER REFLOW - A simplified explanation of the abstract

This abstract first appeared for US patent application 18613954 titled 'BONDING THROUGH MULTI-SHOT LASER REFLOW

The method described in the patent application involves using laser shots to reflow solder regions between two package components.

• First, a laser shot is performed on a first portion of the top surface of the first package component, causing reflow of the first solder region.
• Subsequently, a second laser shot is performed on a second portion of the top surface of the first package component, reflowing a second solder region between the two package components.

Potential Applications: - This technology could be used in the manufacturing of electronic devices where precise soldering is required. - It may find applications in the semiconductor industry for assembling components with high accuracy.

Problems Solved: - The technology addresses the need for efficient and precise soldering of package components in electronic devices. - It helps in achieving reliable connections between different components.

Benefits: - Improved soldering accuracy and reliability. - Enhanced efficiency in the manufacturing process of electronic devices.

Commercial Applications: Title: Advanced Laser Soldering Technology for Electronics Manufacturing This technology could be utilized in the production of smartphones, laptops, and other electronic devices to ensure high-quality soldering of components, leading to improved performance and durability.

Questions about Laser Soldering Technology: 1. How does laser soldering compare to traditional soldering methods? Laser soldering offers advantages such as precise control, minimal heat impact, and the ability to solder in hard-to-reach areas, making it a preferred choice for certain applications.

2. What are the key factors to consider when implementing laser soldering technology in manufacturing processes? Factors to consider include the type of materials being soldered, the required solder joint strength, the speed of the process, and the overall cost-effectiveness of using laser soldering technology.

Original Abstract Submitted

A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.