18612193. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
SANG-UK Kim of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18612193 titled 'SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME
The semiconductor package described in the abstract consists of multiple layers and chips interconnected within the package substrate.
- Package includes a package substrate, first and second re-distribution layers, a connection substrate, and multiple semiconductor chips.
- Connection substrate is interposed between the first and second re-distribution layers, with a connection hole penetrating it.
- First semiconductor chip is mounted on the first re-distribution layer, while the first connection chip is mounted on the opposite surface of the first re-distribution layer and is placed in the connection hole.
- Second connection chip is mounted on the first surface of the second re-distribution layer and is also placed in the connection hole.
- First lower semiconductor chip is mounted on the second surface of the second re-distribution layer.
Potential Applications: - This technology can be used in advanced semiconductor packaging for various electronic devices. - It can enhance the performance and efficiency of integrated circuits in smartphones, computers, and other electronic gadgets.
Problems Solved: - Provides a compact and efficient way to interconnect multiple semiconductor chips within a package. - Improves the overall functionality and reliability of semiconductor devices.
Benefits: - Increased integration density within semiconductor packages. - Enhanced electrical connectivity and signal transmission between chips. - Improved thermal management and overall performance of electronic devices.
Commercial Applications: - This technology can be utilized in the manufacturing of high-performance electronic devices such as smartphones, tablets, and laptops. - It can also find applications in automotive electronics, industrial automation, and telecommunications equipment.
Questions about the technology: 1. How does this semiconductor package improve the overall performance of electronic devices? 2. What are the key advantages of using multiple re-distribution layers in semiconductor packaging?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technologies to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
A semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.
