18610280. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18610280 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application consists of a first semiconductor chip with a first obverse surface and a first reverse surface, a second semiconductor chip with a second obverse surface and a second reverse surface, and a conductive member connecting the two chips.
- The first and second semiconductor chips are electrically connected in series.
- The conductive member includes a first conductive plate that is connected to both semiconductor chips.
- At least one of the semiconductor chips is an IGBT (Insulated Gate Bipolar Transistor) with a collector electrode, an emitter electrode, and a gate electrode.
- The first conductive plate is positioned between the first and second semiconductor chips in the thickness direction.
Potential Applications: - Power electronics - Renewable energy systems - Electric vehicles - Industrial automation
Problems Solved: - Improved efficiency in power conversion - Enhanced reliability in electronic systems - Better thermal management in semiconductor devices
Benefits: - Higher performance in power applications - Increased durability and longevity of electronic components - Enhanced safety features in electrical systems
Commercial Applications: Title: "Advanced Semiconductor Device for Power Electronics Applications" This technology can be utilized in various commercial sectors such as renewable energy, electric vehicles, industrial automation, and power distribution systems. The market implications include improved energy efficiency, enhanced reliability, and increased safety standards in electronic devices.
Questions about the technology: 1. How does the use of IGBTs improve the performance of the semiconductor device? 2. What are the potential cost savings associated with implementing this technology in power electronics systems?
Frequently Updated Research: Researchers are continuously exploring ways to enhance the efficiency and reliability of semiconductor devices in various applications. Stay updated on the latest advancements in power electronics and semiconductor technology to leverage the benefits of this innovative device.
Original Abstract Submitted
A semiconductor device comprises: a first semiconductor chip including a first obverse surface and a first reverse surface spaced apart from each other in a thickness direction; a second semiconductor chip including a second obverse surface and a second reverse surface spaced apart from each other in the thickness direction, and electrically connected in series to the first semiconductor chip; and a conductive member including a first conductive plate electrically connected to the first semiconductor chip and the second semiconductor chip. At least one of the first semiconductor chip and the second semiconductor chip is an IGBT including a collector electrode, an emitter electrode, and a gate electrode. The first conductive plate is provided between the first semiconductor chip and the second semiconductor chip in the thickness direction.
