18609340. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18609340 titled 'PLASMA PROCESSING APPARATUS
Simplified Explanation: The patent application describes a technique for reducing the pressure at which a heat transfer medium is supplied to a flow path in a plasma processing apparatus.
- The plasma processing apparatus includes a chamber, a plasma generator, a temperature adjustment target, and a supply.
- The supply consists of a first tank, a second tank, a pump, and a heat exchanger.
- The first tank stores the heat transfer medium and is connected to the flow path via a first pipe.
- The second tank also stores the heat transfer medium, is connected to the flow path via a second pipe, and is linked to the first tank via a third pipe.
- The second tank is positioned lower than the first tank.
Key Features and Innovation:
- Technique for reducing pressure in supplying heat transfer medium.
- Plasma processing apparatus with specific components for heat transfer medium supply.
- Utilization of multiple tanks and pipes for efficient heat transfer medium distribution.
Potential Applications:
- Semiconductor manufacturing processes.
- Thin film deposition.
- Solar cell production.
- LED manufacturing.
Problems Solved:
- Ensures optimal heat transfer in plasma processing.
- Reduces pressure-related issues in heat transfer medium supply.
- Enhances overall efficiency of the plasma processing apparatus.
Benefits:
- Improved heat transfer efficiency.
- Enhanced performance of plasma processing.
- Reduction in maintenance and downtime.
- Cost savings in the long run.
Commercial Applications: Commercial Applications:
- Plasma processing equipment manufacturers.
- Semiconductor industry.
- Solar energy sector.
- LED lighting manufacturers.
Prior Art: Prior Art: Prior art related to this technology may include patents or research papers on heat transfer techniques in plasma processing equipment.
Frequently Updated Research: Frequently Updated Research: Research on advancements in heat transfer technologies for plasma processing applications may provide further insights into this innovation.
Questions about Plasma Processing Technology: 1. How does the technique described in the patent application improve the efficiency of heat transfer in plasma processing? 2. What specific advantages does the use of multiple tanks and pipes for heat transfer medium supply offer in a plasma processing apparatus?
Original Abstract Submitted
A technique for reducing a pressure at which a heat transfer medium is supplied to a flow path is provided. In an exemplary embodiment, a plasma processing apparatus is provided. The plasma processing apparatus includes a chamber, a plasma generator, a temperature adjustment target, and a supply. The supply supplies a heat transfer medium to the flow path and includes a first tank, a second tank, a pump, and a heat exchanger. The first tank stores the heat transfer medium and is connected to the flow path via a first pipe. The second tank stores the heat transfer medium, is connected to the flow path via a second pipe, and is connected to the first tank via a third pipe. The second tank is disposed at a position lower than a position of the first tank.
