18605892. SUBSTRATE TRANSFER SYSTEM simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE TRANSFER SYSTEM
Organization Name
Inventor(s)
Tatsuru Okamura of Miyagi (JP)
Norihiko Amikura of Miyagi (JP)
Takehiro Shindo of Nirasaki, Yamanashi (JP)
SUBSTRATE TRANSFER SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18605892 titled 'SUBSTRATE TRANSFER SYSTEM
The abstract describes a substrate transfer system that includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly consists of a substrate processing chamber, a substrate support, and a first temperature sensor that measures the temperature of the substrate support. The substrate transfer assembly comprises a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer has a first end-effector for high-temperature substrates, a second end-effector for low-temperature substrates, and a deposit detector near one of the end-effectors. The temperature control system includes a cooling gas supply, a second temperature sensor for the internal space of the robotic substrate transferrer, and a temperature adjuster based on the second temperature sensor's output.
- Substrate transfer system with advanced temperature control features
- Robotic substrate transferrer with end-effectors for high and low-temperature substrates
- Temperature sensors for measuring substrate support and internal space temperatures
- Cooling gas supply for adjusting temperature based on sensor readings
- Enhanced substrate processing and transfer capabilities
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production - LED manufacturing - Microelectronics fabrication
Problems Solved: - Ensuring precise temperature control during substrate processing and transfer - Preventing substrate damage due to temperature variations - Improving overall efficiency and quality of manufacturing processes
Benefits: - Enhanced control over substrate temperature - Reduced risk of substrate damage - Increased production efficiency and quality - Improved reliability in manufacturing processes
Commercial Applications: Title: Advanced Substrate Transfer System for Semiconductor Manufacturing This technology can be used in semiconductor manufacturing facilities to optimize substrate processing and transfer, leading to improved production efficiency and product quality. The market implications include increased competitiveness, reduced production costs, and enhanced technological capabilities.
Questions about Substrate Transfer Systems: 1. How does the temperature control system in the substrate transfer assembly work? The temperature control system includes a cooling gas supply that adjusts the temperature based on readings from the second temperature sensor in the robotic substrate transferrer.
2. What are the key features of the robotic substrate transferrer? The robotic substrate transferrer has end-effectors for high and low-temperature substrates, as well as a deposit detector for enhanced substrate handling.
Original Abstract Submitted
A substrate transfer system includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly includes a substrate processing chamber, a substrate support, and a first temperature sensor that measures a temperature of the substrate support. The substrate transfer assembly includes a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer includes a first end-effector that holds a high-temperature substrate, a second end-effector that holds a low-temperature substrate, and a deposit detector located adjacent to at least one of the end-effectors. The temperature control system includes a cooling gas supply that supplies a cooling gas into the robotic substrate transferrer, a second temperature sensor that measures a temperature of an internal space of the robotic substrate transferrer, and a temperature adjuster that adjusts a temperature of the cooling gas based on an output from the second temperature sensor.
