18605500. SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED
Organization Name
Inventor(s)
Ryoichi Kato of Matsumoto-city (JP)
Yuichiro Hinata of Matsumoto-city (JP)
Yuma Murata of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED - A simplified explanation of the abstract
This abstract first appeared for US patent application 18605500 titled 'SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED
The semiconductor device described in the abstract consists of first and second conductive portions with a gap between them, connection wiring bonded to the front surfaces of these portions, and a wire connecting the bonding portions.
- The wiring portion of the device includes a vertical portion perpendicular to the first conductive portion, a parallel portion running parallel to the conductive portions with a wire bonding portion, and an inclined portion towards the second bonding portion.
- The wire is bonded to the wire bonding portion on the parallel portion of the wiring.
- This design allows for efficient connection between the conductive portions and the wire, enhancing the overall functionality of the semiconductor device.
- The unique structure of the wiring portion enables stable and reliable connections within the device.
- The device's configuration optimizes the flow of electrical signals, improving performance and reliability.
Potential Applications: - This technology can be applied in various semiconductor devices such as integrated circuits and microprocessors. - It can also be used in electronic components for telecommunications and computing systems.
Problems Solved: - Provides a solution for efficient and reliable connection between conductive portions in semiconductor devices. - Enhances the overall performance and functionality of electronic components.
Benefits: - Improved connectivity and signal flow within semiconductor devices. - Enhanced reliability and stability of electronic components. - Increased efficiency and performance of integrated circuits and microprocessors.
Commercial Applications: - This technology can be utilized in the manufacturing of advanced electronic devices for various industries such as telecommunications, computing, and consumer electronics.
Questions about the technology: 1. How does the unique structure of the wiring portion contribute to the overall performance of the semiconductor device? 2. What are the specific advantages of using this technology in integrated circuits and microprocessors?
Original Abstract Submitted
A semiconductor device including: first and second conductive portions having a gap therebetween; connection wiring including first and second bonding portions respectively bonded to front surfaces of the first and second conductive portions, and a wiring portion straddling the gap and connecting the first and second bonding portions; and a wire bonded to the wiring portion. The wiring portion includes: a vertical portion extending, from a lower end to an upper end thereof, perpendicularly to the first conductive portion, the lower end being connected to the first bonding portion; a parallel portion extending in parallel to the first and second conductive portions from the upper end of the vertical portion, the parallel portion having, on a front surface thereof, a wire bonding portion to which one end of the wire is bonded; and an inclined portion extending inclinedly from the parallel portion toward the second bonding portion.
