18605034. THERMALLY REGULATED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
Contents
THERMALLY REGULATED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Chen Yu Huang of Taichung (TW)
Chong Leong Gan of Taichung (TW)
THERMALLY REGULATED SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18605034 titled 'THERMALLY REGULATED SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device assembly that includes a substrate, one or more semiconductor dies, and a thermally conductive material (such as carbon nanotubes or graphene) to dissipate heat from the assembly, resulting in a thermally regulated semiconductor device.
- The semiconductor device assembly includes a substrate and semiconductor dies.
- A thermally conductive material, like carbon nanotubes or graphene, is used to dissipate heat.
- The assembly ensures the semiconductor device remains thermally regulated.
Key Features and Innovation:
- Utilization of thermally conductive materials like carbon nanotubes or graphene.
- Dissipation of heat from the semiconductor device assembly.
- Assembly of a thermally regulated semiconductor device.
Potential Applications:
The technology can be applied in various electronic devices, such as computers, smartphones, and other gadgets requiring efficient heat dissipation for optimal performance.
Problems Solved:
The technology addresses the issue of heat buildup in semiconductor devices, which can lead to performance degradation and even failure if not properly managed.
Benefits:
- Improved performance and longevity of semiconductor devices.
- Enhanced thermal regulation for better overall functionality.
- Potential for increased efficiency in electronic devices.
Commercial Applications:
Title: Thermally Conductive Semiconductor Device Assembly for Enhanced Performance
This technology can have significant commercial applications in the electronics industry, particularly in the development of high-performance computing devices, smartphones, and other consumer electronics where heat management is crucial for optimal functionality and longevity.
Questions about Semiconductor Device Assembly:
1. How does the use of thermally conductive materials like carbon nanotubes or graphene improve the performance of semiconductor devices?
- The use of thermally conductive materials helps dissipate heat efficiently, preventing overheating and ensuring optimal performance of semiconductor devices.
2. What are the potential long-term benefits of utilizing a thermally regulated semiconductor device assembly?
- The long-term benefits include improved device longevity, enhanced performance, and increased efficiency in electronic devices.
Original Abstract Submitted
A semiconductor device assembly is provided. The semiconductor device assembly can include a substrate and one or more semiconductor dies. The semiconductor device assembly can further include a thermally conductive material (e.g., carbon nanotubes, graphene) capable of dissipating heat from the semiconductor device assembly. In doing so, a thermally regulated semiconductor device can be assembled.
