18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Harry-Hak-Lay Chuang of Zhubei city (TW)

Wei-Cheng Wu of Zhubei City (TW)

Wen-Tuo Huang of Tainan City (TW)

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18604542 titled 'BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

The abstract describes bonded wafer device structures, such as wafer-on-wafer (WoW) structures, and methods of fabricating these structures, including an array of contact pads formed in an interconnect level of at least one wafer.

• Array of contact pads formed in an interconnect level of at least one wafer corresponds to an array pattern of contact pads subsequently formed over the bonded wafer structure.
• Enables improved testing of individual wafers, including circuit probe testing, before stacking and bonding to form a bonded wafer structure.

Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Integrated circuit fabrication

Problems Solved: - Enhanced testing capabilities for individual wafers - Improved efficiency in wafer bonding processes

Benefits: - Higher quality control in semiconductor production - Increased reliability of integrated circuits - Streamlined fabrication processes

Commercial Applications: Title: Advanced Wafer Bonding Technology for Semiconductor Industry This technology can be utilized in the production of various electronic devices, including smartphones, computers, and automotive electronics. It can also benefit companies involved in semiconductor manufacturing and research.

Prior Art: Readers can explore prior research on wafer bonding techniques, semiconductor fabrication methods, and integrated circuit testing processes to gain a deeper understanding of the technology's background.

Frequently Updated Research: Stay updated on the latest advancements in wafer bonding technologies, semiconductor industry trends, and innovations in integrated circuit testing for potential insights into future developments.

Questions about Bonded Wafer Device Structures: 1. How does the array of contact pads in the interconnect level improve testing processes? 2. What are the key differences between traditional wafer bonding methods and the WoW structures described in the abstract?

Original Abstract Submitted

Bonded wafer device structures, such as a wafer-on-wafer (WoW) structures, and methods of fabricating bonded wafer device structures, including an array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure. The array of contact pads formed in an interconnect level of at least one wafer may have an array pattern that corresponds to an array pattern of contact pads that is subsequently formed over a surface of the bonded wafer structure. The array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure may enable improved testing of individual wafers, including circuit probe testing, prior to the wafer being stacked and bonded to one or more additional wafers to form a bonded wafer structure.