18603288. Liquid Ejecting Head And Liquid Ejecting Apparatus simplified abstract (SEIKO EPSON CORPORATION)
Contents
Liquid Ejecting Head And Liquid Ejecting Apparatus
Organization Name
Inventor(s)
Haruki Kobayashi of Matsumoto (JP)
Liquid Ejecting Head And Liquid Ejecting Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603288 titled 'Liquid Ejecting Head And Liquid Ejecting Apparatus
Simplified Explanation: The liquid ejecting head described in the patent application includes a head chip and a flow path structure joined by two different adhesives. The flow path structure has multiple flow paths, with one coupled to the head chip by the first adhesive and another closed off by the second adhesive in a specific region.
- The liquid ejecting head consists of a head chip and a flow path structure.
- The head chip is connected to the flow path structure using two different adhesives.
- The flow path structure has a common flow path, a first selection flow path, and a second selection flow path.
- The first selection flow path is connected to the head chip by the first adhesive.
- The second selection flow path is closed off by the second adhesive in a specific closed region.
- The closed region surrounds the opening of the second selection flow path at a distance when viewed from the stacking direction of the head chip and the flow path structure.
Potential Applications: This technology could be used in inkjet printers, 3D printing, and other liquid ejecting devices where precise control of liquid flow is essential.
Problems Solved: The liquid ejecting head design addresses the need for a reliable and efficient way to control the flow of liquid in printing and other applications.
Benefits: - Improved accuracy and precision in liquid ejection - Enhanced reliability and durability of the liquid ejecting head - Simplified manufacturing process for liquid ejecting devices
Commercial Applications: The liquid ejecting head technology could have significant implications in the printing industry, medical device manufacturing, and industrial applications requiring precise liquid dispensing.
Questions about liquid ejecting head technology: 1. How does the use of two different adhesives improve the performance of the liquid ejecting head? 2. What are the potential cost savings associated with implementing this technology in industrial applications?
Original Abstract Submitted
There is provided a liquid ejecting head including a head chip and a flow path structure to which the head chip is joined by a first-adhesive and a second-adhesive, in which the flow path structure has a common flow path, a first-selection-flow-path coupled to the common flow path and liquid-tightly coupled to the chip-side flow path of the head chip by the first-adhesive, and a second-selection-flow-path coupled to the common flow path, an outer surface of the flow path structure includes a closed region surrounding an opening of the second-selection-flow-path at a distance from the opening when viewed in a stacking direction of the head chip and the flow path structure, and the head chip adheres to the flow path structure via the second-adhesive in the closed region so that the second-selection-flow-path is closed.
