18602732. FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE simplified abstract (CANON KABUSHIKI KAISHA)
FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE
Organization Name
Inventor(s)
TAKAMITSU Tokuda of Kanagawa (JP)
FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18602732 titled 'FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE
The abstract describes a flexible electric wiring substrate with multiple groups, each containing wiring, a connector land, a pad, and a plating lead for current supply during electrolytic plating.
- The substrate includes wiring, connector lands, pads, and plating leads for current supply during electrolytic plating.
- Multiple plating leads are arranged for inspection probes to be abutted onto each lead.
- The substrate offers flexibility and versatility in electric wiring applications.
- The design allows for efficient and effective plating processes on electronic parts.
- The innovation enhances the functionality and reliability of electric wiring systems.
Potential Applications: - Electronics manufacturing - Automotive industry - Aerospace technology - Medical devices - Consumer electronics
Problems Solved: - Simplifies the process of electric wiring and plating - Enhances the reliability of connections - Improves efficiency in manufacturing electronic devices
Benefits: - Increased flexibility in wiring applications - Enhanced reliability of electrical connections - Improved efficiency in plating processes - Cost-effective solution for electronic manufacturing
Commercial Applications: "Flexible Electric Wiring Substrate for Enhanced Plating Processes in Various Industries"
Questions about the technology: 1. How does the design of the substrate improve the efficiency of plating processes? 2. What are the key advantages of using this flexible electric wiring substrate in electronics manufacturing?
Original Abstract Submitted
Provided is a flexible electric wiring substrate including multiple groups each including wiring, a connector land that electrically connects a terminal of a connector to the wiring, a pad that connects a terminal of an electronic part to the wiring, and a plating lead that is electrically connected with the pad through the wiring and is used as a current supply port at least in a case of electrolytic plating of the pad, in which the multiple plating leads are arranged such that each of multiple inspection probes arrayed on a probe holding substrate is abutted onto each plating lead.
