18600829. TRANSFER APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
TRANSFER APPARATUS
Organization Name
Inventor(s)
Masahiro Dogome of Miyagi (JP)
TRANSFER APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18600829 titled 'TRANSFER APPARATUS
The patent application describes a transfer apparatus with two vacuum transfer modules, each containing a transfer robot and at least one ring. A tubular connecting module is positioned between the two vacuum transfer modules, with a wafer support attached to it. The wafer support has three ring supporting members to hold the rings.
- The transfer apparatus includes two vacuum transfer modules with transfer robots and rings.
- A tubular connecting module connects the two vacuum transfer modules.
- A wafer support attached to the tubular connecting module has three ring supporting members.
- The tubular connecting module is smaller in length than the wafer diameter.
- The arrangement allows for efficient transfer of wafers and rings in a manufacturing process.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Automated assembly processes
Problems Solved: - Efficient transfer of wafers and rings - Streamlined manufacturing processes - Reduced risk of damage to delicate components
Benefits: - Increased productivity - Improved precision in handling components - Cost-effective manufacturing solutions
Commercial Applications: Title: "Advanced Transfer Apparatus for Semiconductor Manufacturing" This technology can be used in semiconductor manufacturing facilities to enhance the efficiency and accuracy of wafer and ring transfer processes. It can also be applied in other industries requiring precise component handling.
Questions about the technology: 1. How does the tubular connecting module improve the transfer process? The tubular connecting module allows for seamless transfer of wafers and rings between the two vacuum transfer modules, enhancing efficiency and reducing the risk of damage.
2. What are the advantages of having a wafer support with ring supporting members? The wafer support with ring supporting members ensures stable and secure positioning of the rings during the transfer process, minimizing the potential for errors or damage.
Original Abstract Submitted
A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.
