18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tsung-Ding Wang of Tainan (TW)
Chien-Hsun Lee of Chu-tung Town (TW)
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18598250 titled 'MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
Simplified Explanation: The patent application describes a method for making a semiconductor device by placing two dies over a carrier substrate, forming molding materials and redistribution layers, and bonding them to a substrate.
Key Features and Innovation:
- Placement of multiple dies over a carrier substrate
- Formation of molding materials adjacent to the dies
- Creation of redistribution layers over the molding materials
- Incorporation of package components with redistribution layers
- Bonding the semiconductor device to a substrate
Potential Applications: This technology can be used in the manufacturing of various semiconductor devices such as microprocessors, memory chips, and sensors.
Problems Solved: This technology addresses the challenges of efficiently assembling and bonding multiple components in a semiconductor device.
Benefits:
- Improved performance and reliability of semiconductor devices
- Enhanced integration of multiple components in a compact space
- Cost-effective manufacturing process
Commercial Applications: The technology can be applied in the production of consumer electronics, automotive systems, and industrial machinery.
Prior Art: Readers can explore prior art related to semiconductor device manufacturing processes, packaging technologies, and substrate bonding methods.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging techniques, materials science, and integration technologies relevant to this innovation.
Questions about Semiconductor Device Manufacturing: 1. What are the key challenges in semiconductor device packaging? 2. How does the use of multiple dies in a semiconductor device impact its performance and functionality?
Original Abstract Submitted
A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material is formed adjacent to the first die and the second die. A first redistribution layer is formed overlying the first molding material. A through via is formed over the first redistribution layer. A package component is on the first redistribution layer next to the copper pillar. The package component includes a second redistribution layer. The package component is positioned so that it overlies both the first die and the second die in part. A second molding material is formed adjacent to the package component and the first copper pillar. A third redistribution layer is formed overlying the second molding material. The second redistribution layer is placed on a substrate and bonded to the substrate.
