18592442. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Questions about Semiconductor Device Attachment
- 1.10 Frequently Updated Research
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Toshimitsu Arai of Chigasaki Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18592442 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device with two chips attached using adhesives, where the second chip has an overhang region that does not overlap the first chip. The first adhesive includes an extension portion that overlaps the overhang region of the second chip.
- The semiconductor device has two chips attached using adhesives.
- The second chip has an overhang region that does not overlap the first chip.
- The first adhesive includes an extension portion that overlaps the overhang region of the second chip.
Potential Applications
This technology could be used in various semiconductor devices where compact and secure chip attachment is required. It could be beneficial in applications where space is limited, such as in mobile devices or IoT devices.
Problems Solved
This technology solves the problem of securely attaching two semiconductor chips together without overlapping, allowing for more compact and efficient designs.
Benefits
The benefits of this technology include improved space utilization, secure chip attachment, and potential cost savings in manufacturing processes.
Commercial Applications
- Semiconductor manufacturing industry
- Mobile device manufacturers
- IoT device manufacturers
Questions about Semiconductor Device Attachment
1. How does the overhang region of the second chip contribute to the overall design of the semiconductor device? 2. What are the potential challenges in manufacturing processes when using this technology?
Frequently Updated Research
There may be ongoing research in the semiconductor industry related to innovative chip attachment methods and materials. Researchers may be exploring ways to further optimize the design and performance of semiconductor devices using similar techniques.
Original Abstract Submitted
According to one embodiment, a semiconductor device comprises: a first semiconductor chip on which a first adhesive is attached to a rear surface thereof; and a second semiconductor chip on which a second adhesive is attached to a rear surface thereof, wherein the second semiconductor chip is attached to a front surface of the first semiconductor chip via the second adhesive, the second semiconductor chip has an overhang region that does not overlap the first semiconductor chip when viewed in a first direction, and the first adhesive includes a base portion and also includes an extension portion that extends in a second direction from the base portion of the first adhesive to beyond an edge of the first semiconductor chip, at least a part of the extension portion of the first adhesive overlapping the overhang region of the second semiconductor chip when viewed in the first direction.
