18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoshio Mizuta of Yokkaichi (JP)
Sadatoshi Murakami of Yokkaichi (JP)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18591438 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The patent application describes a method of manufacturing a semiconductor device using laser beam irradiation.
- The method involves preparing a substrate with projections, stacking films on the substrate and another substrate, bonding the films, irradiating with a laser beam, and peeling the substrate.
- The laser beam spot area is larger than the pitch between the projections on the substrate.
Potential Applications:
- This technology can be used in the production of advanced semiconductor devices with high precision and efficiency.
Problems Solved:
- The method addresses the challenge of manufacturing semiconductor devices with intricate structures and high accuracy.
Benefits:
- Improved precision and efficiency in the manufacturing process.
- Enhanced performance and reliability of semiconductor devices.
Commercial Applications:
- This technology could be valuable in the semiconductor industry for producing cutting-edge electronic components.
Prior Art:
- Researchers can explore prior patents related to laser beam technology in semiconductor manufacturing processes.
Frequently Updated Research:
- Stay updated on advancements in laser technology for semiconductor manufacturing to enhance efficiency and precision.
Questions about Semiconductor Device Manufacturing: 1. How does the laser beam irradiation improve the manufacturing process?
- The laser beam irradiation helps in precise and efficient processing of semiconductor devices by allowing for controlled material removal.
2. What are the potential challenges faced in implementing this method on an industrial scale?
- Some challenges may include scalability, cost-effectiveness, and process optimization for mass production.
Original Abstract Submitted
According to one embodiment, there is provided a method of manufacturing a semiconductor device. The method includes preparing a first substrate on which multiple projections distributed in a two-dimensional fashion are formed. The method includes stacking a first film over the multiple projections on the first substrate. The method includes stacking a second film on a second substrate. The method includes bonding a principal surface of the first film which is disposed on an opposite side of the first substrate to a principal surface of the second film which is disposed on an opposite side of the second substrate. The method includes performing irradiation with a laser beam from the first substrate. The method includes peeling the first substrate. A diameter of a spot area formed by the laser beam is larger than an average pitch between the projections arranged on the principal surface of the first substrate.
