18590235. SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Kioxia Corporation)
Contents
SEMICONDUCTOR MANUFACTURING APPARATUS
Organization Name
Inventor(s)
Takashi Ohashi of Yokkaichi Mie (JP)
SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18590235 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS
Simplified Explanation:
The semiconductor manufacturing apparatus described in the patent application consists of a front end module with a load port connected to a conveyance container and multiple processing units arranged around the front end module. The processing units are designed to process semiconductor substrates, and the substrates are conveyed between the conveyance container and the processing units through the front end module.
- The semiconductor manufacturing apparatus includes a front end module with a load port and processing units.
- The processing units are positioned around the front end module and process semiconductor substrates.
- Semiconductor substrates are conveyed between the conveyance container and the processing units through the front end module.
Potential Applications:
This technology could be used in semiconductor manufacturing facilities to streamline the processing of semiconductor substrates and improve overall efficiency in production.
Problems Solved:
This technology addresses the need for a more efficient and organized way to process semiconductor substrates in manufacturing facilities.
Benefits:
The benefits of this technology include increased efficiency, improved organization, and potentially higher output in semiconductor manufacturing processes.
Commercial Applications:
Potential commercial applications of this technology could include semiconductor manufacturing companies looking to enhance their production processes and increase output.
Questions about Semiconductor Manufacturing Apparatus:
1. How does the front end module improve the efficiency of semiconductor substrate processing? 2. What are the key advantages of using this semiconductor manufacturing apparatus in a production facility?
Original Abstract Submitted
A semiconductor manufacturing apparatus includes a front end module with a load port to which a conveyance container is connected on an upper surface; and a plurality of processing units configured to process a semiconductor substrate, disposed around the front end module in a plan view from a normal direction of the upper surface of the front end module, and each connected to the front end module from at least two directions in the plan view. The semiconductor substrate is conveyed between the conveyance container and the processing units via the front end module.
