18582488. MEMORY DEVICE INTERFACE COMMUNICATING WITH SET OF DATA BURSTS CORRESPONDING TO MEMORY DIES VIA DEDICATED PORTIONS FOR COMMAND PROCESSING simplified abstract (Lodestar Licensing Group LLC)
MEMORY DEVICE INTERFACE COMMUNICATING WITH SET OF DATA BURSTS CORRESPONDING TO MEMORY DIES VIA DEDICATED PORTIONS FOR COMMAND PROCESSING
Organization Name
Inventor(s)
Luigi Pilolli of L'Aquila (IT)
MEMORY DEVICE INTERFACE COMMUNICATING WITH SET OF DATA BURSTS CORRESPONDING TO MEMORY DIES VIA DEDICATED PORTIONS FOR COMMAND PROCESSING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18582488 titled 'MEMORY DEVICE INTERFACE COMMUNICATING WITH SET OF DATA BURSTS CORRESPONDING TO MEMORY DIES VIA DEDICATED PORTIONS FOR COMMAND PROCESSING
The abstract of the patent application describes a method where commands associated with different memory dies are communicated through different portions of an interface in a memory sub-system. Data bursts corresponding to each memory die are then communicated through another portion of the interface simultaneously with the commands.
- First command associated with a first memory die communicated via a first portion of the interface
- Second command associated with a second memory die communicated via the first portion of the interface
- Data burst corresponding to the first memory die communicated via a second portion of the interface
- Second command communicated concurrently with the data burst
Potential Applications: - Memory sub-systems in electronic devices - Data processing systems - High-speed data transfer applications
Problems Solved: - Efficient communication between memory dies - Simultaneous data transfer and command communication
Benefits: - Faster data transfer speeds - Improved memory sub-system performance - Enhanced overall system efficiency
Commercial Applications: Title: "Advanced Memory Sub-System Technology for High-Speed Data Processing" This technology could be utilized in various electronic devices such as smartphones, tablets, and computers to enhance data processing speeds and overall performance.
Questions about the technology: 1. How does this technology improve data transfer speeds in memory sub-systems? 2. What are the potential implications of using this technology in high-speed data processing applications?
Frequently Updated Research: Stay updated on the latest advancements in memory sub-system technology to ensure optimal performance and efficiency in electronic devices.
Original Abstract Submitted
A first command associated with a first memory die is communicated via a first portion of an interface of the memory sub-system. A second command associated with a second memory die is communicated via the first portion of the interface to a second memory die. A data burst corresponding to the first memory die is caused to be communicated via a second portion of the interface, where the second command is communicated via the first portion of the interface concurrently with the data burst communicated via the second portion of the interface.
