18573177. CAMERA DEVICE simplified abstract (LG INNOTEK CO., LTD.)

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CAMERA DEVICE

Organization Name

LG INNOTEK CO., LTD.

Inventor(s)

Deok Yong Lee of Seoul (KR)

Sung Il Lee of Seoul (KR)

Jun Hyeok Hong of Seoul (KR)

CAMERA DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18573177 titled 'CAMERA DEVICE

The present invention is a camera device with a unique design that includes a lens holder, housing, sensor board, connection board, base, and main board.

  • Lens holder for accommodating a lens
  • Housing surrounding the lens holder
  • Sensor board with an image sensor mounted from below the housing
  • Connection board connected to the sensor board
  • Base below the board part
  • Main board below the base
  • Connection board with a different thickness than the sensor board

Potential Applications: - Surveillance cameras - Photography equipment - Video recording devices

Problems Solved: - Improved image sensor mounting process - Enhanced durability and stability of the camera device

Benefits: - Higher quality images and videos - Increased longevity of the camera device - Simplified maintenance and repair processes

Commercial Applications: - Camera manufacturing industry - Security and surveillance companies - Photography equipment retailers

Questions about the technology: 1. How does the different thickness of the connection board benefit the overall design of the camera device? 2. What specific improvements does the unique sensor board mounting process offer compared to traditional methods?

Frequently Updated Research: - Ongoing advancements in image sensor technology - Innovations in camera device design and functionality


Original Abstract Submitted

An embodiment of the present invention provides a camera device comprising: a lens holder for accommodating a lens; a housing surrounding the lens holder, a board part including a sensor board, to which an image sensor is mounted from below the housing, and a connection board, which is connected to the sensor board; a base disposed below the board part; and a main board disposed below the base, wherein the connection board has a different thickness than the sensor board.