18570145. POWER SEMICONDUCTOR DEVICE simplified abstract (Hitachi Astemo, Ltd.)
Contents
POWER SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takashi Hirao of Hitachinaka-shi (JP)
Yujiro Kaneko of Hitachinaka-shi (JP)
POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18570145 titled 'POWER SEMICONDUCTOR DEVICE
Simplified Explanation: The patent application describes a power semiconductor device with a circuit body, a cooler, and an insulating member to enhance heat dissipation.
- The device includes a circuit body where a conductor plate and a semiconductor element are sealed with a sealing resin.
- A cooler is positioned opposite to the circuit body to dissipate heat effectively.
- An insulating member is placed between the circuit body and the cooler, consisting of an insulating sheet, a conductor layer, and heat dissipation grease to improve thermal conductivity.
Key Features and Innovation:
- Sealed circuit body with a conductor plate and a semiconductor element.
- Cooler for efficient heat dissipation.
- Insulating member with layers to enhance thermal conductivity.
Potential Applications: This technology can be applied in power electronics, electric vehicles, renewable energy systems, and industrial machinery.
Problems Solved: The technology addresses issues related to heat dissipation in power semiconductor devices, improving their efficiency and reliability.
Benefits:
- Enhanced heat dissipation capabilities.
- Improved performance and reliability of power semiconductor devices.
- Extended lifespan of electronic components.
Commercial Applications: The technology can be utilized in the manufacturing of power inverters, motor drives, solar inverters, and other high-power electronic systems, catering to industries such as automotive, renewable energy, and industrial automation.
Questions about Power Semiconductor Device: 1. How does the insulating member contribute to the thermal management of the device? 2. What are the potential cost savings associated with the improved heat dissipation in power semiconductor devices?
Original Abstract Submitted
Provided is a power semiconductor device including: a circuit body in which a conductor plate and a semiconductor element mounted on the conductor plate are sealed with a sealing resin; a cooler disposed opposite to at least one surface of the circuit body; and an insulating member disposed between the circuit body and the cooler, the insulating member including: an insulating sheet bonded to the cooler; a conductor layer bonded to a surface of the insulating sheet, the surface facing the circuit body; and electrically insulating heat dissipation grease filled between the circuit body and the cooler, and formed covering the insulating sheet and the conductor layer.
