18564396. CIRCUIT ASSEMBLY simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
CIRCUIT ASSEMBLY
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
CIRCUIT ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18564396 titled 'CIRCUIT ASSEMBLY
The circuit assembly described in the patent application consists of a relay, a case housing the relay, and a bus bar with a fastening part and a heat transfer part.
- The relay includes an excitation connector part on a side surface, open in a direction opposite to the connection part.
- The bus bar's fastening part is designed to be fastened to the relay's connection part and is in thermal contact with an external heat dissipation target.
- The fastening part protrudes upward from the heat transfer part on the bottom wall of the case at an angle larger than 90°.
- The excitation connector part of the relay is open obliquely upward, connected to the fastening part of the bus bar.
Potential Applications: - Automotive industry for vehicle electronics - Industrial automation for control systems - Power distribution systems for efficient heat dissipation
Problems Solved: - Improved thermal management in relay assemblies - Enhanced reliability and performance in electronic circuits
Benefits: - Increased efficiency in heat dissipation - Extended lifespan of relay components - Enhanced overall system reliability
Commercial Applications: Title: "Advanced Thermal Management Solutions for Electronic Circuits" This technology can be utilized in automotive, industrial, and power distribution sectors to improve thermal performance and reliability of electronic circuits.
Prior Art: Research in thermal management solutions for electronic components and relay assemblies can provide insights into existing technologies and innovations in this field.
Frequently Updated Research: Stay updated on advancements in thermal management techniques, materials, and designs for electronic circuits to enhance the performance and reliability of relay assemblies.
Questions about the technology: 1. How does the design of the bus bar improve heat transfer in the circuit assembly? 2. What are the potential cost-saving benefits of implementing this thermal management solution in electronic systems?
Original Abstract Submitted
A circuit assembly includes: a relay; a case that houses the relay; and a bus bar including a fastening part configured to be fastened to a connection part of the relay, and a heat transfer part configured to be in thermally conductive contact with an external heat dissipation target, wherein the relay includes an excitation connector part that is provided on a side surface of the relay, and that is open in a direction opposite to a direction in which the connection part is open, the fastening part of the bus bar protrudes upward from the heat transfer part disposed on a bottom wall side of the case so as to be inclined at an angle larger than 90°, and the excitation connector part of the relay in which the connection part connected to the fastening part of the bus bar is open obliquely upward.
