18562411. POWER CONVERSION DEVICE simplified abstract (Hitachi Astemo, Ltd.)
Contents
POWER CONVERSION DEVICE
Organization Name
Inventor(s)
Fusanori Nishikimi of Hitachinaka-shi (JP)
Takashi Hirao of Hitachinaka-shi (JP)
POWER CONVERSION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18562411 titled 'POWER CONVERSION DEVICE
The power conversion device described in the abstract consists of a semiconductor module, a drive circuit board, a control circuit board, and a cooling member.
- The semiconductor module contains a sealed semiconductor element.
- The drive circuit board houses the drive circuit responsible for operating the semiconductor element.
- The control circuit board contains the control circuit that manages the drive circuit.
- A partition wall within the housing divides the device into a first space and a second space.
- The drive circuit board is located in the first space, positioned to face the semiconductor module with a cooling member in between.
- The control circuit board is situated in the second space.
Potential Applications: This technology can be applied in various power conversion systems, such as inverters, converters, and motor drives.
Problems Solved: This innovation addresses the challenge of efficiently cooling the semiconductor module while maintaining the functionality of the drive and control circuits.
Benefits: The device's design allows for effective cooling of the semiconductor module, ensuring optimal performance and longevity of the power conversion system.
Commercial Applications: This technology can be utilized in renewable energy systems, electric vehicles, industrial machinery, and other applications requiring power conversion.
Questions about the technology: 1. How does the cooling member enhance the performance of the power conversion device? 2. What are the key differences between this power conversion device and traditional systems?
Frequently Updated Research: Stay updated on advancements in semiconductor cooling technologies and power conversion efficiency to enhance the performance of this device.
Original Abstract Submitted
A power conversion device includes: a semiconductor module in which a semiconductor element is sealed; a drive circuit board on which a drive circuit that drives the semiconductor element is mounted; a control circuit board on which a control circuit that controls the drive circuit is mounted; and a first cooling member that cools the semiconductor module. The power conversion device is divided into a first space and a second space by a partition wall of a housing. The drive circuit board is disposed in the first space so as to face the semiconductor module with the first cooling member interposed between the drive circuit board and the semiconductor module. The control circuit board is disposed in the second space.
