18557468. METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR ASSEMBLY simplified abstract (Robert Bosch GmbH)
Contents
METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR ASSEMBLY
Organization Name
Inventor(s)
Christian Huber of Ludwigsburg (DE)
Holger Wuest of Waldenbuch (DE)
Jens Baringshaus of Sindelfingen (DE)
METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18557468 titled 'METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR ASSEMBLY
The abstract describes a method for filling a rear-side cavity of a semiconductor assembly with a metal layer by dispensing a suspension into the cavity and heating the assembly to sinter the metal-containing powder.
- Dispensing a suspension with a specified drop size into the rear-side cavity of the semiconductor assembly using a drop applicator.
- The suspension contains a metal-containing powder and a liquid dispersion medium, with the metal-containing powder having a particle size in the nanometer range.
- Heating the semiconductor assembly to a temperature of less than 500°C to sinter the metal-containing powder.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Nanotechnology research
Problems Solved: - Efficiently filling rear-side cavities in semiconductor assemblies - Achieving uniform metal layers in cavities - Enhancing semiconductor assembly performance
Benefits: - Improved conductivity - Enhanced thermal properties - Increased reliability of semiconductor assemblies
Commercial Applications: Title: Advanced Semiconductor Assembly Filling Method This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit industries involved in nanotechnology research and development.
Questions about the technology: 1. How does the method of dispensing the suspension ensure uniform filling of the rear-side cavity? 2. What are the advantages of using a metal-containing powder with nanometer-sized particles in semiconductor assembly filling?
Original Abstract Submitted
A method for filling a rear-side cavity of a semiconductor assembly, the rear-side cavity having a metal layer. The method includes: dispensing a suspension with a specified drop size into the rear-side cavity of the semiconductor assembly using a drop applicator, wherein the suspension has a metal-containing powder and a liquid dispersion medium and the metal-containing powder has a particle size in the nanometer range; and heating the semiconductor assembly to a temperature of less than 500° C., whereby the metal-containing powder is sintered.
