18552076. Contactless Conveying Device simplified abstract (Robert Bosch GmbH)

Contactless Conveying Device

Organization Name

Robert Bosch GmbH

Inventor(s)

Heike Raatz of Stuttgart (DE)

Philipp Guth of Stuttgart (DE)

Joachim Frangen of Heilbronn (DE)

Contactless Conveying Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 18552076 titled 'Contactless Conveying Device

Simplified Explanation

The conveying device described in the patent application is designed to transport payloads, such as wafers, using floating transport bodies that move over a stator's transport surface. The transport bodies can move and position themselves in all six degrees of freedom, with a movable boom, manipulator, or robotic arm to handle the payload at the end effector. Additionally, an additional transport body can be used for processing and checking the payload.

• The conveying device transports payloads using floating transport bodies.
• The transport bodies can move in all six degrees of freedom.
• A movable boom, manipulator, or robotic arm is used to handle the payload.
• An additional transport body can be used for processing and checking the payload.

Potential Applications

The technology described in the patent application could be applied in industries such as semiconductor manufacturing, pharmaceuticals, and electronics assembly where precise handling and processing of delicate payloads are required.

Problems Solved

This technology solves the problem of efficiently and accurately transporting and processing payloads, such as wafers, in a controlled and precise manner.

Benefits

The benefits of this technology include increased efficiency, improved accuracy, and reduced risk of damage to the payloads during transportation and processing.

Potential Commercial Applications

A potential commercial application of this technology could be in semiconductor manufacturing facilities where the precise handling and processing of wafers are critical for the production of high-quality semiconductor devices.

Possible Prior Art

One possible prior art for this technology could be automated guided vehicles (AGVs) used in manufacturing facilities for transporting materials and products. However, the specific features and capabilities of the conveying device described in the patent application may differentiate it from existing technologies.

How does the conveying device ensure the stability and safety of the payloads during transportation and processing?

The patent application does not provide detailed information on the specific mechanisms or features that ensure the stability and safety of the payloads. Further clarification on this aspect would be helpful for understanding the reliability of the technology.

What is the potential scalability of the conveying device for handling different types and sizes of payloads?

The patent application does not discuss the scalability of the conveying device for handling various types and sizes of payloads. Understanding the limitations and capabilities of the technology in accommodating different payload requirements would be essential for assessing its versatility and applicability in various industries.

Original Abstract Submitted

A conveying device is configured to convey one or more payloads, in particular wafers, using transport bodies. The transport bodies are floatingly moved and positioned over a transport surface of a stator. The moving and positioning are preferably carried out with respect to all six degrees of freedom. The transport body has a movable boom or a movable manipulator or a movable robotic arm. At an end effector thereof, the payload is deposited or fastened. The payload can also be processed and/or checked. The processing and/or checking is carried out by an end effector of an additional transport body of the same conveying device.