18539634. SUBSTRATE TREATING APPARATUS simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE TREATING APPARATUS
Organization Name
Inventor(s)
Gyeong Won Song of Cheonan-si (KR)
Byung Hwi Kim of Hwaseong-si (KR)
Chun Woo Park of Yongin-si (KR)
SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18539634 titled 'SUBSTRATE TREATING APPARATUS
The inventive concept provides a substrate treating apparatus that cools a support plate with a heater faster than conventional methods. The apparatus includes a housing with a treating space and a support unit for holding the substrate. The support unit has a heater member on the support plate to heat the substrate and a cooling unit to cool the heater member. The cooling unit includes gas supply nozzles positioned under the heater member to supply cooling gas.
- Support plate with a heater member for fast substrate heating
- Cooling unit with gas supply nozzles to cool the heater member efficiently
- Housing with treating space for substrate treatment
- Innovative design for quicker substrate processing
- Improved cooling system for enhanced performance
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production - LCD screen manufacturing
Problems Solved: - Slow substrate heating and cooling processes - Inefficient cooling of heater members - Inconsistent substrate treatment results
Benefits: - Faster substrate processing times - Improved efficiency in heating and cooling - Enhanced quality and consistency in substrate treatment
Commercial Applications: Title: Advanced Substrate Treating Apparatus for Semiconductor Manufacturing This technology can be used in various industries such as semiconductor manufacturing, thin film deposition processes, and solar panel production. The faster heating and cooling capabilities improve overall efficiency and quality in substrate treatment processes, making it a valuable tool for commercial applications.
Questions about Substrate Treating Apparatus: 1. How does the cooling unit in the apparatus contribute to faster substrate processing? The cooling unit includes gas supply nozzles positioned strategically under the heater member to efficiently cool the substrate, allowing for quicker processing times.
2. What are the potential applications of this innovative substrate treating apparatus? This technology can be applied in industries such as semiconductor manufacturing, thin film deposition processes, and solar panel production for improved efficiency and quality in substrate treatment.
Original Abstract Submitted
The inventive concept provides a substrate treating apparatus which is cool a support plate having a heater faster than a conventional substrate treating apparatus. The substrate treating apparatus includes a housing providing a treating space therein; and a support unit configured to support a substrate at the treating space. The support unit includes a heater member provided at the support plate to heat the substrate and a cooling unit configured to cool the heater member. The cooling unit includes a first gas supply nozzle positioned under an edge of the heater member for supplying a cooling gas to a center direction of a bottom surface of the heater member and a second gas supply nozzle positioned under a center of the heater member for supplying the cooling gas in an edge direction of the bottom surface of the heater member.
