18537661. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Euisang Lim of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18537661 titled 'SUBSTRATE PROCESSING APPARATUS
The abstract describes a substrate processing apparatus that includes two drying units, each using a drying fluid to dry a substrate with a liquid film. The apparatus also includes fluid supply units for each drying unit, as well as doors to control pressure within each unit.
- The substrate processing apparatus has a first drying unit and a second drying unit, each performing a drying process using a drying fluid on a substrate.
- There are fluid supply units for each drying unit to supply the drying fluid.
- The first door controls the opening and closing of the first drying unit, while the second door controls the second drying unit.
- The first door opens when pressure in the first drying unit reaches a specific pressure, and the second door opens when pressure in the second drying unit reaches another specific pressure.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production
Problems Solved: - Efficient drying of substrates with liquid films - Controlled pressure conditions during drying processes
Benefits: - Improved substrate processing efficiency - Enhanced quality of dried substrates - Reduced risk of damage to substrates during drying
Commercial Applications: "Advanced Substrate Processing Apparatus for Semiconductor Manufacturing and Thin Film Deposition"
Questions about the technology: 1. How does the apparatus ensure the uniform drying of substrates with liquid films? 2. What are the specific pressure levels at which the doors of the drying units open and close?
Original Abstract Submitted
A substrate processing apparatus includes a first drying unit configured to perform a first drying process using a drying fluid on a substrate having a liquid film formed thereon, a first fluid supply unit configured to supply the drying fluid into the first drying unit, a second drying unit configured to perform a second drying process using the drying fluid on the substrate on which the first drying process is performed, a second fluid supply unit configured to supply the drying fluid into the second drying unit, a first door configured to control opening and closing of the first drying unit, and a second door configured to control opening and closing of the second drying unit, wherein the first door is opened when pressure in the first drying unit reaches a first transfer pressure, and the second door is opened when pressure in the second drying unit reaches a second transfer pressure.
