18534706. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Ker-Yih Kao of Miao-Li County (TW)
Chung-Jyh Lin of Miao-Li County (TW)
Chin-Ming Huang of Miao-Li County (TW)
Chien-Lin Lai of Miao-Li County (TW)
Kuo-Sheng Yeh of Miao-Li County (TW)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18534706 titled 'ELECTRONIC DEVICE
The abstract describes an electronic device with a unique heat dissipation layer containing silicon carbide particles with rounded-corner structures.
- The electronic device includes at least one chip unit, a circuit structure, and a heat dissipation layer.
- The heat dissipation layer consists of an insulating material layer and silicon carbide particles.
- The silicon carbide particles have rounded-corner structures, enhancing heat dissipation efficiency.
- The insulating material layer clads the silicon carbide particles, providing insulation and protection.
- This innovative design improves the thermal management of electronic devices, increasing their performance and longevity.
Potential Applications: - Consumer electronics - Automotive electronics - Industrial machinery
Problems Solved: - Overheating issues in electronic devices - Thermal stress on components - Reduced performance due to heat buildup
Benefits: - Improved heat dissipation efficiency - Enhanced device performance and longevity - Reduced risk of thermal damage
Commercial Applications: Title: Enhanced Heat Dissipation Technology for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, and industrial machinery to improve the thermal management of electronic devices, leading to better performance and reliability in demanding applications.
Prior Art: Readers can explore prior patents related to heat dissipation technologies in electronic devices, focusing on materials and structures used for efficient thermal management.
Frequently Updated Research: Stay updated on the latest advancements in heat dissipation materials and technologies for electronic devices to ensure optimal performance and reliability.
Questions about Heat Dissipation Technology: 1. How does the rounded-corner structure of silicon carbide particles enhance heat dissipation efficiency? 2. What are the potential challenges in implementing this innovative heat dissipation layer in electronic devices?
Original Abstract Submitted
An electronic device is provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have rounded-corner structures.
