18532810. SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER simplified abstract (Robert Bosch GmbH)
Contents
- 1 SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Wafer Stress Management
- 1.13 Original Abstract Submitted
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
Organization Name
Inventor(s)
Bernhard Polzinger of Stuttgart (DE)
Christian Foerster of Reutlingen (DE)
Jens Buettner of Reutlingen (DE)
Kristina Vogt of Muenchingen (DE)
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18532810 titled 'SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
Simplified Explanation
The patent application describes a semiconductor wafer with different mechanical stress regions on the front side. A structured carrier substrate with different materials and properties is placed on the front side to match these stress regions.
Key Features and Innovation
- Semiconductor wafer with different mechanical stress regions on the front side.
- Structured carrier substrate with different materials and properties to match the stress regions.
Potential Applications
This technology could be used in the semiconductor industry for manufacturing processes that require precise control of mechanical stress on wafers.
Problems Solved
This technology addresses the challenge of managing mechanical stress in semiconductor wafers, which is crucial for ensuring the reliability and performance of electronic devices.
Benefits
- Improved control of mechanical stress in semiconductor wafers.
- Enhanced reliability and performance of electronic devices.
Commercial Applications
- Semiconductor manufacturing industry for producing high-quality electronic devices.
- Research and development for advancing semiconductor technology.
Prior Art
Readers can explore prior patents related to semiconductor wafer stress management and carrier substrate technologies to understand the evolution of this field.
Frequently Updated Research
Stay updated on the latest advancements in semiconductor wafer technology and stress management techniques to enhance your understanding of this innovation.
Questions about Semiconductor Wafer Stress Management
How does this technology impact the performance of electronic devices?
This technology ensures better control of mechanical stress, leading to improved reliability and performance in electronic devices.
What are the potential challenges in implementing this technology in semiconductor manufacturing processes?
Implementing this technology may require specialized equipment and processes to ensure proper alignment of the carrier substrate with the stress regions on the wafer.
Original Abstract Submitted
A semiconductor wafer having a front side and a rear side, the front side is opposite the rear side. The front side has different mechanical stress regions. A structured carrier substrate that has different materials with different material properties is arranged on the front side, wherein the different materials are arranged on the different mechanical stress regions.
