18529346. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yongsung Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18529346 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a wiring substrate with a solder ball on its lower surface, a ball land with a circular upper surface between the wiring substrate and the solder ball, and a mask layer covering the lower surface of the wiring substrate with an opening exposing a portion of the ball land.
- The ball land consists of a first land region with a semicircular upper surface of a certain radius exposed through the opening, and a second land region integrated with a flat side surface of the first land region, having a semicircular upper surface with a smaller radius.
- The innovation lies in the design of the ball land, which allows for efficient and reliable connections within the semiconductor package.
- This technology enhances the performance and durability of semiconductor packages, ensuring stable electrical connections.
- The unique configuration of the ball land improves the overall quality and functionality of the semiconductor package.
- By optimizing the design of the ball land, this innovation contributes to advancements in semiconductor packaging technology.
Potential Applications: This technology can be applied in various semiconductor devices such as microprocessors, memory modules, and integrated circuits.
Problems Solved: This technology addresses issues related to electrical connections and reliability in semiconductor packages.
Benefits: Improved performance, enhanced durability, and stable electrical connections in semiconductor packages.
Commercial Applications: This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment, among other applications.
Questions about the technology: 1. How does the design of the ball land contribute to the reliability of electrical connections in semiconductor packages? 2. What are the potential implications of this technology for the semiconductor industry?
Original Abstract Submitted
A semiconductor package includes a wiring substrate, a solder ball on a lower surface of the wiring substrate, a ball land between the lower surface of the wiring substrate and the solder ball and having an upper surface having a circular shape, and a mask layer covering the lower surface of the wiring substrate and including an opening through which a portion of the ball land is exposed. The ball land includes a first land region which is exposed via the opening and has an upper surface having a semicircular shape with a first radius and a second land region which is integrated with a flat side surface of the first land region and has an upper surface having a semicircular shape with a second radius that is less than the first radius.
