18497672. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYOUNGLIM Suk of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18497672 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of various components such as a lower redistribution structure, a lower chip structure, posts, an encapsulant, a heat dissipation member, an upper chip structure, and external connection bumps.
- The lower redistribution structure includes a lower redistribution layer, while the posts consist of a lower metal layer and an upper metal layer.
- The encapsulant covers the lower chip structure and the posts.
- The heat dissipation member overlaps with at least a portion of the lower chip structure.
- The upper chip structure overlaps with at least a portion of the posts and is electrically connected to the lower redistribution layer through the posts.
- External connection bumps are located below the lower redistribution structure.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics and industrial equipment.
Problems Solved: - Provides efficient heat dissipation for the semiconductor package. - Enables reliable electrical connections between different components. - Enhances the overall performance and longevity of electronic devices.
Benefits: - Improved thermal management. - Enhanced electrical connectivity. - Increased reliability and durability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the consumer electronics industry to improve the efficiency and reliability of electronic devices. It can also benefit manufacturers of automotive electronics and industrial equipment by enhancing the performance and longevity of their products.
Questions about the technology: 1. How does this semiconductor package improve heat dissipation compared to traditional packaging methods? 2. What are the specific advantages of using different metals in the lower and upper metal layers of the posts?
Original Abstract Submitted
A semiconductor package includes a lower redistribution structure including a lower redistribution layer, a lower chip structure disposed on the lower redistribution structure, a plurality of posts disposed around the lower chip structure and including a lower metal layer on the lower redistribution layer and an upper metal layer on the lower metal layer, an encapsulant covering respective side surfaces of the lower chip structure and the plurality of posts, a heat dissipation member disposed on the encapsulant and vertically overlapping at least a portion of the lower chip structure, an upper chip structure disposed on one side of the heat dissipation member and vertically overlapping at least a portion of the plurality of posts, and electrically connected to the lower redistribution layer through the plurality of posts, and external connection bumps disposed below the lower redistribution structure. The lower metal layer and the upper metal layer include different metals.
