18492251. COMPUTER HOUSING simplified abstract (Apple Inc.)

COMPUTER HOUSING

Organization Name

Apple Inc.

Inventor(s)

Eugene A. Whang of San Francisco CA (US)

Christopher J. Stringer of Woodside CA (US)

Brett W. Degner of Menlo Park CA (US)

David H. Narajowski of Los Gatos CA (US)

Patrick Kessler of San Francisco CA (US)

Eric R. Prather of Santa Clara CA (US)

Caitlin Elizabeth Kalinowski of San Francisco CA (US)

Adam T. Stagnaro of Santa Cruz CA (US)

Daniel L. Mcbroom of Leonard TX (US)

Matthew P. Casebolt of Fremont CA (US)

Michael D. Mcbroom of Leonard TX (US)

COMPUTER HOUSING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18492251 titled 'COMPUTER HOUSING

Simplified Explanation

• A desktop computing system is described with a central core surrounded by housing that defines a volume for the core.
• The housing has a first opening and a second opening, with the second opening axially displaced from the first opening.
• The first opening is designed for airflow to act as a heat transfer medium to cool internal components, while the second opening has a lip that engages the airflow to transfer heat to the housing.
• This design allows for efficient cooling of internal components by transferring heat to the airflow and then to the housing.

Potential Applications

• Desktop computers
• Workstations
• Servers

Problems Solved

• Overheating of internal components
• Inefficient cooling systems
• Space constraints for cooling solutions

Benefits

• Improved cooling efficiency
• Enhanced thermal management
• Increased longevity of internal components

Original Abstract Submitted

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.