18483929. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)

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CIRCUIT MODULE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Yoshihito Otsubo of Nagaokakyo-shi (JP)

Hideo Nakagoshi of Nagaokakyo-shi (JP)

Hiroki Yoshimori of Nagaokakyo-shi (JP)

CIRCUIT MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18483929 titled 'CIRCUIT MODULE

The patent application describes a circuit board assembly with components mounted on both upper and lower surfaces of the boards.

  • The upper circuit board body has a first upper main surface and a first lower main surface.
  • The lower circuit board body has a second upper main surface and a second lower main surface.
  • Mounting electrodes are located on the second upper main surface for mounting components.
  • Conductor members are mounted on the mounting electrodes to connect components.
  • A second conductor member on the first lower main surface connects to the upper end of the first conductor member.
    • Key Features and Innovation:**
  • Components mounted on both upper and lower surfaces of circuit boards.
  • Efficient use of space by overlapping components and conductor members.
  • Improved connectivity and assembly of electronic devices.
    • Potential Applications:**

This technology can be applied in various electronic devices such as smartphones, tablets, and computers.

    • Problems Solved:**

This technology addresses the challenge of optimizing space and connectivity in electronic devices with multiple components.

    • Benefits:**
  • Enhanced efficiency in circuit board assembly.
  • Improved connectivity and space utilization.
  • Potential for smaller and more compact electronic devices.
    • Commercial Applications:**

This technology could be utilized in the consumer electronics industry to enhance the performance and design of electronic devices.

    • Prior Art:**

No information provided on prior art related to this technology.

    • Frequently Updated Research:**

No information provided on frequently updated research relevant to this technology.

    • Questions about Circuit Board Assembly:**

1. How does this technology improve the efficiency of electronic devices? 2. What are the potential challenges in implementing this circuit board assembly in mass production?


Original Abstract Submitted

An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

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